Interfacial reactions in thermoelectric modules

dc.contributor.authorWu, Hsin-jay
dc.contributor.authorWu, Albert T.
dc.contributor.authorWei, Pei-chun
dc.contributor.authorChen, Sinn-wen
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.institutionDepartment of Materials and Optoelectronic Science, National Sun Yat-sen University, Kaohsiung, Taiwan
dc.contributor.institutionDepartment of Chemical and Materials Engineering, National Central University, Taoyuan, Taiwan
dc.contributor.institutionDepartment of Chemical Engineering, National Tsing Hua University, Hsinchu, Taiwan
dc.date.accessioned2018-02-27T09:00:11Z
dc.date.available2018-02-27T09:00:11Z
dc.date.issued2018-02-20
dc.date.published-online2018-02-20
dc.date.published-print2018-04-03
dc.description.abstractEngineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well.
dc.description.sponsorshipThe authors acknowledge the financial support from the Ministry of Science and Technology, Taiwan [grant number 106-2221-E-110-025-MY3].
dc.eprint.versionPublisher's Version/PDF
dc.identifier.citationWu H, Wu AT, Wei P, Chen S (2018) Interfacial reactions in thermoelectric modules. Materials Research Letters 6: 244–248. Available: http://dx.doi.org/10.1080/21663831.2018.1436092.
dc.identifier.doi10.1080/21663831.2018.1436092
dc.identifier.issn2166-3831
dc.identifier.journalMaterials Research Letters
dc.identifier.urihttp://hdl.handle.net/10754/627196
dc.publisherInforma UK Limited
dc.relation.urlhttp://www.tandfonline.com/doi/full/10.1080/21663831.2018.1436092
dc.rightsThis is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/
dc.subjectThermoelectric (TE) material and module
dc.subjectinterfacial reaction
dc.subjectBi2Te3
dc.subjectPbTe
dc.titleInterfacial reactions in thermoelectric modules
dc.typeArticle
display.details.left<span><h5>License</h5>http://creativecommons.org/licenses/by/4.0/<br><br><h5>Type</h5>Article<br><br><h5>Authors</h5><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.author=Wu, Hsin-jay,equals">Wu, Hsin-jay</a><br><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.author=Wu, Albert T.,equals">Wu, Albert T.</a><br><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.author=Wei, Pei-chun,equals">Wei, Pei-chun</a><br><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.author=Chen, Sinn-wen,equals">Chen, Sinn-wen</a><br><br><h5>KAUST Department</h5><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.department=Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division,equals">Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division</a><br><br><h5>Online Publication Date</h5>2018-02-20<br><br><h5>Print Publication Date</h5>2018-04-03<br><br><h5>Date</h5>2018-02-20</span>
display.details.right<span><h5>Abstract</h5>Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well.<br><br><h5>Citation</h5>Wu H, Wu AT, Wei P, Chen S (2018) Interfacial reactions in thermoelectric modules. Materials Research Letters 6: 244–248. Available: http://dx.doi.org/10.1080/21663831.2018.1436092.<br><br><h5>Acknowledgements</h5>The authors acknowledge the financial support from the Ministry of Science and Technology, Taiwan [grant number 106-2221-E-110-025-MY3].<br><br><h5>Publisher</h5><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.publisher=Informa UK Limited,equals">Informa UK Limited</a><br><br><h5>Journal</h5><a href="https://repository.kaust.edu.sa/search?spc.sf=dc.date.issued&spc.sd=DESC&f.journal=Materials Research Letters,equals">Materials Research Letters</a><br><br><h5>DOI</h5><a href="https://doi.org/10.1080/21663831.2018.1436092">10.1080/21663831.2018.1436092</a><br><br><h5>Additional Links</h5>http://www.tandfonline.com/doi/full/10.1080/21663831.2018.1436092</span>
kaust.personWei, Pei-chun
orcid.authorWu, Hsin-jay
orcid.authorWu, Albert T.
orcid.authorWei, Pei-chun
orcid.authorChen, Sinn-wen
refterms.dateFOA2018-06-14T03:51:39Z
Files
Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
2_26_2018_Interfacia.pdf
Size:
1.32 MB
Format:
Adobe Portable Document Format
Description:
Published version