Embedding complex objects with 3d printing

Type
Patent

Patent Status
Published Application

Authors
Hussain, Muhammad Mustafa
Diaz, Cordero Marlon Steven

Assignee
King Abdullah University Of Science And Technology

KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program

Date
2017-10-12

Submitted Date
2016-04-08

Abstract
A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.

Application Number
WO 2017175159 A1

Additional Links
http://www.google.com/patents/WO2017175159A1http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017175159A1&KC=A1&FT=D

Permanent link to this record