Heterogeneous Multi-Dimensional Integrated Circuit for Internet-of-Things Application

Abstract
A novel CMOS-enabled heterogeneous integration and packaging technology based on multi-dimensional (MD) integration of thin-film components to combine between the best of SoC IC integration and best of SiP package integration is demonstrated. As a proof-of-concept, we demonstrate a prototype of a cubic MD-IC (4D system) that includes multi-functional sensors, antenna, microcontroller, light-emitting-diode (LED), a micro-lithium-ion battery and a solar cell. Devices are fabricated on both sides of each substrate (Si, Ge and GaSb) and are interconnected using through-silicon-vias (TSVs) and side interlocks. PDMS encapsulation shows improved mechanical performance. The resulting system is a complete, multi-functional, lightweight, high-performance and compact packaged system. The MD-IC package passed preliminary component-level and system-level reliability tests. Finally, the MD-IC provides an enhanced yield and cost of the system due to the capability to fabricate and test smaller dies separately before integrating them into a complete package.

Citation
El-Atab, N., Shaikh, S. F., Khan, S., Yun, J., & Hussain, M. M. (2019). Heterogeneous Multi-Dimensional Integrated Circuit for Internet-of-Things Application. 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). doi:10.1109/s3s46989.2019.9320723

Publisher
Institute of Electrical and Electronics Engineers (IEEE)

Conference/Event Name
2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2019

DOI
10.1109/S3S46989.2019.9320723

Additional Links
https://ieeexplore.ieee.org/document/9320723/

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