A DGTD Scheme for Modeling the Radiated Emission From DUTs in Shielding Enclosures Using Near Electric Field Only

Abstract
To meet the electromagnetic interference regulation, the radiated emission from device under test such as electronic devices must be carefully manipulated and accurately characterized. Instead of resorting to the direct far-field measurement, in this paper, a novel approach is proposed to model the radiated emission from electronic devices placed in shielding enclosures by using the near electric field only. Based on the Schelkkunoff’s equivalence principle and Raleigh–Carson reciprocity theorem, only the tangential components of the electric field over the ventilation slots and apertures of the shielding enclosure are sufficient to obtain the radiated emissions outside the shielding box if the inside of the shielding enclosure was filled with perfectly electric conductor (PEC). In order to efficiently model wideband emission, the time-domain sampling scheme is employed. Due to the lack of analytical Green’s function for arbitrary PEC boxes, the radiated emission must be obtained via the full-wave numerical methods by considering the total radiated emission as the superposition between the direct radiation from the equivalent magnetic currents in free space and the scattered field generated by the PEC shielding box. In this study, the state-of-the-art discontinuous Galerkin time-domain (DGTD) method is utilized, which has the flexibility to model irregular geometries, keep high-order accuracy, and more importantly involves only local operations. For open-region problems, a hybridized DGTD and time-domain boundary integration method applied to rigorously truncate the computational domain. To validate the proposed approach, several representative examples are presented and compared with both analytical and numerical results.

Citation
A DGTD Scheme for Modeling the Radiated Emission From DUTs in Shielding Enclosures Using Near Electric Field Only 2016:1 IEEE Transactions on Electromagnetic Compatibility

Publisher
Institute of Electrical and Electronics Engineers (IEEE)

Journal
IEEE Transactions on Electromagnetic Compatibility

DOI
10.1109/TEMC.2016.2515363

Additional Links
http://ieeexplore.ieee.org/lpdocs/epic03/wrapper.htm?arnumber=7381665

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