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    Inkjet-Printed Ferrite Substrate Based Vialess Waveguide Phase Shifter

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    Inkjet-Printed_Ferrite_Substrate_Based_Vialess_Waveguide_Phase_Shifter.pdf
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    Type
    Article
    Authors
    Myrzakhan, Ulan cc
    Ghaffar, Farhan A. cc
    Vaseem, Mohammad cc
    Fariborzi, Hossein cc
    Shamim, Atif cc
    KAUST Department
    Electrical and Computer Engineering Program
    Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
    Date
    2023-02-03
    Permanent link to this record
    http://hdl.handle.net/10754/687493
    
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    Abstract
    Magnetically controlled waveguide-based phase shifters are desirable for their high performance, but are bulky and heavy, thus cannot be easily integrated with printed circuit board (PCB) based circuits. To tackle this, substrate-integrated waveguide (SIW) technology has been utilized, which brings the waveguide to a standard PCB, but requires large numbers of vias as well as multiple cavities in the substrate for ferrite slab placement. This implementation technique involves complex fabrication and yields a relatively low figure of merit (FoM). To alleviate this, we present the first completely vialess ferrite substrate-based waveguide phase shifter realized through low-cost inkjet printing technique. All the four sides of a yttrium iron garnet (YIG) substrate have been metalized through inkjet printing, allowing the fabrication of a conventional rectangular waveguide on a standard magnetic substrate. The prototype has been tested in symmetric as well as antisymmetric modes of biasing and peak FoMs of 160°/dB at 7.22 GHz and 332°/dB at 7.46 GHz have been measured, which are higher than those of the previously reported designs. This all-around inkjet printing approach can open the door to low-cost, integrable magnetic phase shifters with excellent RF performances.
    Citation
    Myrzakhan, U., Ghaffar, F. A., Vaseem, M., Fariborzi, H., & Shamim, A. (2023). Inkjet-Printed Ferrite Substrate Based Vialess Waveguide Phase Shifter. IEEE Transactions on Magnetics, 1–1. https://doi.org/10.1109/tmag.2023.3242088
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    IEEE Transactions on Magnetics
    DOI
    10.1109/tmag.2023.3242088
    Additional Links
    https://ieeexplore.ieee.org/document/10036053/
    ae974a485f413a2113503eed53cd6c53
    10.1109/tmag.2023.3242088
    Scopus Count
    Collections
    Articles; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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