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    Theoretical Analysis of Dielectric Assisted Tamm Mode Excitation

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    AKG Manuscript_revised.pdf
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    Description:
    Accepted manuscript
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    Type
    Conference Paper
    Authors
    Goyal, Amit Kumar
    Pradhan, K. P.
    Massoud, Yehia Mahmoud cc
    KAUST Department
    Innovative Technologies Laboratories (ITL), King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia
    Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
    Electrical and Computer Engineering Program
    Date
    2022-11-08
    Permanent link to this record
    http://hdl.handle.net/10754/685680
    
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    Abstract
    In this paper, a dielectric material assisted excitation mechanism is proposed to confine Tamm Modes at the dielectric-air interface. The performance analysis of proposed structure is performed using transfer matrix method (TMM). The design comprises a bilayer one-dimensional photonic crystal structure having a top defect layer. The defect layer thickness, and incident angles are optimized to confirm the Tamm mode confinement at an operating wavelength of 632.8nm. The proposed structure shows a strong Tamm mode localization for a defect layer thickness of 210nm. Whereas an evanescent Tamm mode is also excited for a lower defect layer thickness of around 170nm.
    Citation
    Goyal, A. K., Pradhan, K. P., & Massoud, Y. (2022). Theoretical Analysis of Dielectric Assisted Tamm Mode Excitation. 2022 IEEE 22nd International Conference on Nanotechnology (NANO). https://doi.org/10.1109/nano54668.2022.9928633
    Publisher
    IEEE
    Conference/Event name
    2022 IEEE 22nd International Conference on Nanotechnology (NANO)
    ISBN
    978-1-6654-5226-7
    DOI
    10.1109/NANO54668.2022.9928633
    Additional Links
    https://ieeexplore.ieee.org/document/9928633/
    https://ieeexplore.ieee.org/document/9928633/
    https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9928633
    ae974a485f413a2113503eed53cd6c53
    10.1109/NANO54668.2022.9928633
    Scopus Count
    Collections
    Conference Papers; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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