Solution-Processed HfO2/Y2O3 Multilayer Si-Based MOS Capacitors Photoactivated by Deep-Ultraviolet Radiation

Abstract
Fabrication of high-quality sol-gel thin films at low-temperature and low-cost is becoming a necessity to realize the full potential of flexible and printed electronics. In this study, we demonstrate a solution-processed metal-oxide-semiconductor (MOS) capacitor deposited on a heavily doped p-type silicon substrate by employing a multilayer dielectric stack of HfO2/Y2O3. The fabrication of the dielectric films was carried out using fast and low-temperature photoactivation treatment under deep-ultraviolet (DUV). Structural and optical properties of multilayers were systemically examined showing the amorphous structural phase with high optical transmission. Electrical measurements of the DUV photoactivated MOS capacitors showed comparable electrical properties to conventional high-temperature thermal annealing. These included a dielectric constant of 10.81 (at 100 kHz), a high areal capacitance of 89.49 nF/cm2 and a low leakage current of ~10−9 A/cm2.

Citation
Almaimouni, A., Kutbee, A., Mudhaffar, A., & Al-Jawhari, H. (2022). Solution-Processed HfO2/Y2O3 Multilayer Si-Based MOS Capacitors Photoactivated by Deep-Ultraviolet Radiation. Journal of Electronic Materials, 51(9), 4944–4951. https://doi.org/10.1007/s11664-022-09738-w

Acknowledgements
The authors would like to thank Dr. Mrinal Hota (Department of Materials Science and Engineering, KAUST, KSA) for his help with the SEM imaging.

Publisher
Springer Science and Business Media LLC

Journal
Journal of Electronic Materials

DOI
10.1007/s11664-022-09738-w

Additional Links
https://link.springer.com/10.1007/s11664-022-09738-w

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