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    A fully-screen printed, multi-layer process for bendable mm-wave antennas

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    Name:
    Final_submission_Jan_22_1.pdf
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    1017.Kb
    Format:
    PDF
    Description:
    Accepted Manuscript
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    Type
    Conference Paper
    Authors
    Akhter, Zubair
    Li, Weiwei cc
    Yu, Yiyang cc
    Shamim, Atif cc
    KAUST Department
    Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
    Electrical and Computer Engineering
    Electrical and Computer Engineering Program
    Date
    2022-05-11
    Permanent link to this record
    http://hdl.handle.net/10754/676864
    
    Metadata
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    Abstract
    In the era of Internet of Things (IoT) and wearable electronics; printing technique, such as screen printing, is becoming popular because of their lower costs and mass manufacturing abilities. However, most of the previous work has been done on printing metallic patterns and not the printing substrates. In this paper, we introduce a custom screen printable dielectric ink (polymer mixed with ceramics), which provides lower loss even at millimeter-wave (mm-wave) bands. With the help of dielectric ink and custom silver nanowires (AgNW) based metallic ink, a multilayer, fully screen-printed fabrication process has been developed. To demonstrate the efficacy of the proposed inks and the multilayer printing process, a stacked patch antenna with 4-parasitic patches in the superstrate is designed, fabricated, and tested for the mm-wave band (5G band). Despite a new fabrication process, the measured results show a decent antenna performance (both in flat and bent positions) where the input impedance is matched from 26.5-30 GHz and a maximum gain of 7.8 dBi has been attained.
    Publisher
    IEEE
    Conference/Event name
    2022 16th European Conference on Antennas and Propagation (EuCAP)
    ISBN
    978-1-6654-1604-7
    Additional Links
    https://ieeexplore.ieee.org/document/9769078/
    https://ieeexplore.ieee.org/document/9769078/
    https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9769078
    Collections
    Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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