Show simple item record

dc.contributor.authorHa, Hee-Bo
dc.contributor.authorLee, Byung Hoon
dc.contributor.authorQaiser, Nadeem
dc.contributor.authorSeo, Youngjae
dc.contributor.authorKim, Jinyong
dc.contributor.authorKoo, Ja Myeong
dc.contributor.authorHwang, Byungil
dc.date.accessioned2022-04-20T08:04:11Z
dc.date.available2022-04-20T08:04:11Z
dc.date.issued2022-03-17
dc.identifier.citationHa, H.-B., Lee, B. H., Qaiser, N., Seo, Y., Kim, J., Koo, J. M., & Hwang, B. (2022). Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics. Intermetallics, 144, 107535. https://doi.org/10.1016/j.intermet.2022.107535
dc.identifier.issn0966-9795
dc.identifier.doi10.1016/j.intermet.2022.107535
dc.identifier.urihttp://hdl.handle.net/10754/676339
dc.description.abstractTo fabricate high-performance flexible electronics, high-density electronic components should be safely integrated into limited areas, even under device deformation. However, simultaneously achieving device flexibility and strong bonds is challenging. Therefore, we fabricated Cu–Sn microdumbbell arrays on perforated polyimide (PI) substrates to develop a flexible interconnection system simultaneously exhibiting strong bonds and device flexibility by combining flexible PI films and metal–metal soldering. Cu microdumbbell arrays were formed by electroplating Cu on ∼5-μm-diameter microholes that were randomly distributed on flexible PI film surfaces and subsequently covering the dumbbell head surface with Sn by electroless plating. The Sn-covered dumbbell heads acted as metallic solder, enabling strong bonds with electronic components through hot pressing by forming nanolayered Cu/Sn intermetallic compounds. Electronic chips bonded by the Cu–Sn microdumbbell arrays exhibited excellent shear bonding strength, even after 10,000 bending cycles. Finite element simulations revealed that crack propagation was hindered by the space between the microdumbbells, thus enhancing the adhesion strength of the flexible interconnection system.
dc.description.sponsorshipPartially supported by the National Research Foundation (NRF) of Korea funded by the Ministry of Science, Information, and Communications Technology (Grant No. NRF- 2021R1F1A1054886) and by the Global Technology Center, Samsung Electronics.
dc.publisherElsevier BV
dc.relation.urlhttps://linkinghub.elsevier.com/retrieve/pii/S0966979522000760
dc.rightsNOTICE: this is the author’s version of a work that was accepted for publication in Intermetallics. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Intermetallics, [144, , (2022-03-17)] DOI: 10.1016/j.intermet.2022.107535 . © 2022. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
dc.subjectEngineering controlled terms: Anisotropy; Copper compounds; Electroless plating; Fabrication; Finite element method; Flip chip devices; Hot pressing; Integrated circuit interconnects; Network components; Polyimides; Soldering
dc.subjectEngineering uncontrolled terms: Anisotropic conductive films; Array film; Electronic component; Finite elements simulation; Flexible; Flexible polyimide; Interconnect; Interconnection systems; Microdumbbell array; Polyimide film
dc.subjectEngineering main heading: Flexible electronics
dc.titleHighly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics
dc.typeArticle
dc.contributor.departmentElectrical Engineering; Computer, Electrical and Mathematical Sciences, and Engineering Division; King Abdullah University of Science and Technology (KAUST); Thuwal 23955-6900; Saudi Arabia
dc.contributor.departmentKAUST Catalysis Center (KCC)
dc.contributor.departmentComputer, Electrical and Mathematical Science and Engineering (CEMSE) Division
dc.contributor.departmentElectrical and Computer Engineering Program
dc.identifier.journalIntermetallics
dc.rights.embargodate2024-03-17
dc.eprint.versionPost-print
dc.contributor.institutionSchool of Integrative Engineering, Chung-Ang University, Seoul 06974, Republic of Korea
dc.contributor.institutionManufacturing Core Technology Team / Global Technology Research, Samsung Electronics, Suwon, Republic of Korea
dc.contributor.institutionSchool of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
dc.identifier.volume144
dc.identifier.pages107535
kaust.personQaiser, Nadeem
dc.identifier.eid2-s2.0-85126555158


This item appears in the following Collection(s)

Show simple item record