Optically Transparent and Flexible Radio Frequency Electronics through Printing Technologies
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Transparent RF_AMT_4th Dec.pdf
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Accepted manuscript
Type
ArticleKAUST Department
Computer, Electrical and Mathematical Science and Engineering (CEMSE) DivisionElectrical and Computer Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Date
2022-01-05Embargo End Date
2023-01-05Submitted Date
2021-09-29Permanent link to this record
http://hdl.handle.net/10754/675022
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With the advent of the Internet of things, 5G wireless communication, and smart city applications, demand for a new form of radio frequency (RF) electronics has risen, one that can be mounted or integrated on non-conformal objects, is mass manufacturable at lower costs, and is optically transparent to maintain the aesthetics of the environment where deployed. This new breed of electronics can be realized through printing technologies, which are capable of manufacturing diverse designs on flexible substrates via large-scale and high-volume printing techniques at lower costs. However, the major challenge for printed electronics is the preparation of conductive inks with performance comparable to their bulk metal counterparts. This review summarizes the recent developments in printable transparent and conductive materials (TCMs), inks, and methods for optically transparent RF passives. In addition, techniques to enhance the conductivity of the TCMs are presented. Moreover, it covers several design examples of optically transparent RF passives, such as antennas, microwave absorbers, and frequency selective surfaces. Furthermore, many challenges and potential solutions are discussed in terms of the TCMs, inks, and printing technologies needed for the realization of such designs. Finally, some future trends in the area of transparent RF electronics and PE are discussed.Citation
Li, W., Akhter, Z., Vaseem, M., & Shamim, A. (2022). Optically Transparent and Flexible Radio Frequency Electronics through Printing Technologies. Advanced Materials Technologies, 2101277. doi:10.1002/admt.202101277Sponsors
The authors give special thanks to KAUST for funding.Publisher
WileyJournal
Advanced Materials TechnologiesAdditional Links
https://onlinelibrary.wiley.com/doi/10.1002/admt.202101277ae974a485f413a2113503eed53cd6c53
10.1002/admt.202101277