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    Inkjet Printing: A Cheap and Easy-to-Use Alternative to Wire Bonding for Academics

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    Type
    Article
    Authors
    Liu, Yingwen
    Zhu, Kaichen
    Hui, Fei
    Yuan, Bin
    Zhang, Chenhui cc
    Ma, Yinchang cc
    Zhang, Xixiang cc
    Lanza, Mario cc
    KAUST Department
    Material Science and Engineering Program
    Physical Science and Engineering (PSE) Division
    Material Science and Engineering
    Date
    2021-12-28
    Permanent link to this record
    http://hdl.handle.net/10754/674283
    
    Metadata
    Show full item record
    Abstract
    Many groups in academia are having problems patterning interconnections to small electrodes using wire bonding, including metal melting and detachment of previously bonded wires. It is a fact that the industry makes reliable wire bonding using automatic setups and expert personnel, and also that many groups in academia can do wire bonding reliably. However, it is also true that wire bonding is much more problematic than other techniques often employed to pattern interconnections, such as lithography or inkjet printing. In this article, the contact resistance and maximum currents driven by metallic interconnections patterned via wire bonding, lithography, and inkjet printing are compared. It is concluded that interconnections patterned via inkjet printing meet the requirements of many types of experiments, and that inkjet printing is a very cheap and easy-to-use alternative to wire bonding, especially attractive for academics.
    Citation
    Liu, Y., Zhu, K., Hui, F., Yuan, B., Zhang, C., Ma, Y., … Lanza, M. (2021). Inkjet Printing: A Cheap and Easy-to-Use Alternative to Wire Bonding for Academics. Crystal Research and Technology, 2100210. doi:10.1002/crat.202100210
    Sponsors
    This work was supported by the Baseline funding scheme of the King Abdullah University of Science and Technology, the Ministry of Science and Technology of China (grant nos. 2018YFE0100800, 2019YFE0124200), the National Natural Science Foundation of China (grant no. 61874075), the Suzhou Science and Technology Bureau, the Ministry of Finance of China (grant no. SX21400213), the 111 Project from the State Administration of Foreign Experts Affairs of China, the Collaborative Innovation Centre of Suzhou Nano Science & Technology, the Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, the Priority Academic Program Development of Jiangsu Higher Education Institutions, and a Technion-Guangdong Fellowship.
    Publisher
    Wiley
    Journal
    Crystal Research and Technology
    DOI
    10.1002/crat.202100210
    Additional Links
    https://onlinelibrary.wiley.com/doi/10.1002/crat.202100210
    ae974a485f413a2113503eed53cd6c53
    10.1002/crat.202100210
    Scopus Count
    Collections
    Articles; Physical Science and Engineering (PSE) Division; Material Science and Engineering Program

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