Integrated Porous Cu Host Induced High-Stable Bidirectional Li Plating/Stripping Behavior for Practical Li Metal Batteries

Abstract

The double-sided electrodes with active materials are widely used for commercial lithium (Li) ion batteries with a higher energy density. Accordingly, developing an anode current collector that can accommodate the stable and homogeneous Li plating/stripping on both sides will be highly desired for practical Li metal batteries (LMBs). Herein, an integrated bidirectional porous Cu (IBP-Cu) film with a through-pore structure is fabricated as Li metal hosts using the powder sintering method. The resultant IBP-Cu current collector with tunable pore volume and size exhibits high mechanical flexibility and stability. The bidirectional and through-pore structure enables the IBP-Cu host to achieve homogeneous Li deposition and effectively suppresses the dendritic Li growth. Impressively, the as-fabricated Li/IBP-Cu anode exhibits a remarkable capacity of up to 7.0 mAh cm-2 for deep plating/stripping, outstanding rate performance, and ultralong cycling ability with high Coulombic efficiency of ≈100% for 1000 cycles. More practicably, a designed pouch cell coupled with one Li/IBP-Cu anode and two LiFePO4 cathodes exhibits a highly elevated energy density (≈187.5%) compared with a pouch cell with one anode and one cathode. Such design of a bidirectional porous Cu current collector with stable Li plating/stripping behaviors suggests its promising practical applications for next-generation Li metal batteries.