Multi-Domain Modeling and Simulation of High Temperature Superconducting Transmission Lines under Short Circuit Fault Conditions
dc.contributor.author | Podlaski, Meaghan | |
dc.contributor.author | Vanfretti, Luigi | |
dc.contributor.author | Khare, Abhijit | |
dc.contributor.author | Sumption, Michael | |
dc.contributor.author | Ansell, Phillip | |
dc.date.accessioned | 2021-12-01T06:53:01Z | |
dc.date.available | 2021-12-01T06:53:01Z | |
dc.date.issued | 2021-11-29 | |
dc.identifier.citation | Podlaski, M., Vanfretti, L., Khare, A., Sumption, M., & Ansell, P. (2021). Multi-Domain Modeling and Simulation of High Temperature Superconducting Transmission Lines under Short Circuit Fault Conditions. IEEE Transactions on Transportation Electrification, 1–1. doi:10.1109/tte.2021.3131271 | |
dc.identifier.issn | 2332-7782 | |
dc.identifier.issn | 2372-2088 | |
dc.identifier.doi | 10.1109/tte.2021.3131271 | |
dc.identifier.uri | http://hdl.handle.net/10754/673854 | |
dc.description.sponsorship | This work was supported in whole or in part by the National Aeronautics and Space Administration under award number 80NSSC19M0125 as part of the Center for High-Efficiency Electrical Technologies for Aircraft (CHEETA), in part by the Engineering Research Center Program of the National Science Foundation and the Department of Energy under Award EEC-1041877 and the CURENT Industry Partnership Program, and by the Center of Excellence for NEOM Research at the King Abdullah University of Science and Technology under grant OSR-2019-CoE-NEOM-4178.12. | |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | |
dc.relation.url | https://ieeexplore.ieee.org/document/9627924/ | |
dc.title | Multi-Domain Modeling and Simulation of High Temperature Superconducting Transmission Lines under Short Circuit Fault Conditions | |
dc.type | Article | |
dc.identifier.journal | IEEE Transactions on Transportation Electrification | |
dc.identifier.pages | 1-1 | |
dc.date.accepted | 2021 | |
dc.date.published-online | 2021 | |
dc.date.published-print | 2022-09 |