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dc.contributor.authorQaiser, Nadeem
dc.contributor.authorDamdam, Asrar Nabil
dc.contributor.authorKhan, Sherjeel M.
dc.contributor.authorElatab, Nazek
dc.contributor.authorHussain, Muhammad Mustafa
dc.date.accessioned2021-07-07T06:53:52Z
dc.date.available2021-07-07T06:53:52Z
dc.date.issued2021-07-07
dc.date.submitted2021-02-23
dc.identifier.citationQaiser, N., Damdam, A. N., Khan, S. M., Elatab, N., & Hussain, M. M. (2021). Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices. Journal of Applied Physics, 130(1), 014902. doi:10.1063/5.0048477
dc.identifier.issn0021-8979
dc.identifier.issn1089-7550
dc.identifier.doi10.1063/5.0048477
dc.identifier.urihttp://hdl.handle.net/10754/670038
dc.description.abstractCurrently, silicon (Si)-based island–interconnect structures are emerging in next-generation stretchable electronic devices such as flexible medical implants, soft robotics, and wearables. Various geometrical designs are being used as interconnects for promising stretchable electronic systems. Among them, self-similar serpentine interconnects (SS-interconnects) are widely used due to their high areal efficiency and stretchability. However, to date, pertinent devices choose random parameters of SS-interconnects since the detailed design guidelines are still elusive. Additionally, no study has revealed how the lateral size or width affects the stretchability during in-plane and out-of-plane stretching. Here, we show how the mechanics could help get the optimized Si-based SS-interconnect without losing its areal efficiency. Our numerical and experimental results show that thin interconnects attain 70%–80% higher stretchability than thicker counterparts. The numerical and experimental results match well. Numerical results indicate the areas prone to break earlier, followed by experimental validation. We devise how induced stress could predict the fracture conditions for any given size and shape of an interconnect. Our results demonstrate that the larger width plays a crucial role in out-of-plane stretching or rotation, i.e., the stress values are 60% higher for the larger width of SS-interconnect during rotation (up to 90°). Our calculations reveal the fracture-free zone for SS-interconnects, showing the figure-of-merit. We demonstrate the detailed guidelines that could help choose the right parameters for fracture-free SS-interconnects for required stretchability, devising the next-generation stretchable and wearable electronic devices.
dc.description.sponsorshipThis publication is based on the work supported by King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award Nos. REP/1/2707-01-01 and REP/1/2880-01-01. The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
dc.publisherAIP Publishing
dc.relation.urlhttps://aip.scitation.org/doi/10.1063/5.0048477
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Journal of Applied Physics and may be found at http://doi.org/10.1063/5.0048477.
dc.rights.uriPublished under an exclusive license by AIP Publishing
dc.titleMechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentmmh Labs, Electrical Engineering, Computer Electrical and Mathematical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955, Saudi Arabia
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journalJournal of Applied Physics
dc.rights.embargodate2022-07-07
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionEECS, University of California, Berkeley, California 94720, USA
dc.identifier.volume130
dc.identifier.issue1
dc.identifier.pages014902
kaust.personQaiser, Nadeem
kaust.personDamdam, Asrar Nabil
kaust.personKhan, Sherjeel Munsif
kaust.personElatab, Nazek
kaust.personHussain, Muhammad Mustafa
kaust.grant.numberREP/1/2707-01-01
kaust.grant.numberREP/1/2880-01-01
dc.date.accepted2021-06-09
refterms.dateFOA2021-07-07T06:55:04Z
kaust.acknowledged.supportUnitOffice of Sponsored Research (OSR)


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