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    Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices

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    mechanical_5.0048477.pdf
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    Type
    Article
    Authors
    Qaiser, Nadeem cc
    Damdam, Asrar Nabil
    Khan, Sherjeel M. cc
    Elatab, Nazek cc
    Hussain, Muhammad Mustafa cc
    KAUST Department
    Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
    Electrical and Computer Engineering Program
    Integrated Nanotechnology Lab
    KAUST Catalysis Center (KCC)
    mmh Labs, Electrical Engineering, Computer Electrical and Mathematical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955, Saudi Arabia
    KAUST Grant Number
    REP/1/2707-01-01
    REP/1/2880-01-01
    Date
    2021-07-07
    Embargo End Date
    2022-07-07
    Submitted Date
    2021-02-23
    Permanent link to this record
    http://hdl.handle.net/10754/670038
    
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    Abstract
    Currently, silicon (Si)-based island–interconnect structures are emerging in next-generation stretchable electronic devices such as flexible medical implants, soft robotics, and wearables. Various geometrical designs are being used as interconnects for promising stretchable electronic systems. Among them, self-similar serpentine interconnects (SS-interconnects) are widely used due to their high areal efficiency and stretchability. However, to date, pertinent devices choose random parameters of SS-interconnects since the detailed design guidelines are still elusive. Additionally, no study has revealed how the lateral size or width affects the stretchability during in-plane and out-of-plane stretching. Here, we show how the mechanics could help get the optimized Si-based SS-interconnect without losing its areal efficiency. Our numerical and experimental results show that thin interconnects attain 70%–80% higher stretchability than thicker counterparts. The numerical and experimental results match well. Numerical results indicate the areas prone to break earlier, followed by experimental validation. We devise how induced stress could predict the fracture conditions for any given size and shape of an interconnect. Our results demonstrate that the larger width plays a crucial role in out-of-plane stretching or rotation, i.e., the stress values are 60% higher for the larger width of SS-interconnect during rotation (up to 90°). Our calculations reveal the fracture-free zone for SS-interconnects, showing the figure-of-merit. We demonstrate the detailed guidelines that could help choose the right parameters for fracture-free SS-interconnects for required stretchability, devising the next-generation stretchable and wearable electronic devices.
    Citation
    Qaiser, N., Damdam, A. N., Khan, S. M., Elatab, N., & Hussain, M. M. (2021). Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices. Journal of Applied Physics, 130(1), 014902. doi:10.1063/5.0048477
    Sponsors
    This publication is based on the work supported by King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award Nos. REP/1/2707-01-01 and REP/1/2880-01-01. The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
    Publisher
    AIP Publishing
    Journal
    Journal of Applied Physics
    DOI
    10.1063/5.0048477
    Additional Links
    https://aip.scitation.org/doi/10.1063/5.0048477
    ae974a485f413a2113503eed53cd6c53
    10.1063/5.0048477
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Integrated Nanotechnology Lab; KAUST Catalysis Center (KCC); Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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