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dc.contributor.authorShao, Qian
dc.contributor.authorLiu, Yin
dc.date.accessioned2021-06-02T07:45:44Z
dc.date.available2021-06-02T07:45:44Z
dc.date.issued2021-04-30
dc.date.submitted2020-11-03
dc.identifier.citationShao, Q., & Liu, Y. (2021). Joule heating effect on thermal stress for a bi-material interface crack. International Journal of Solids and Structures, 226-227, 111069. doi:10.1016/j.ijsolstr.2021.111069
dc.identifier.issn0020-7683
dc.identifier.doi10.1016/j.ijsolstr.2021.111069
dc.identifier.urihttp://hdl.handle.net/10754/669340
dc.description.abstractThe electric-induced Joule heat plays a dominant role for the fracture and failure in electronic devices, particularly in those with bi-material interfaces, yet the effect of Joule heat on temperature elevation and thermal stress for a bi-material interface crack remains incompletely understood. To this end, we develop a coupled electro-thermo-mechanical model for the bi-material interface crack using the extended finite element method. A novel near-tip asymptotic function is introduced as the enrichment field in the finite element approximations of electrical potential and temperature, which well reproduces the singularities of electric current and heat flux near the bi-material interface crack. Using the domain form of the interaction integral, the complex stress intensity factors and energy release rate are evaluated for bi-material interface cracks. The results of several benchmarking tests demonstrate the accuracy and robustness of the proposed model. The effects of the Joule heat and the mismatch of material properties on the stress intensity factors and energy release rate at the interfacial crack tip are investigated. The results not only reveal the significant contribution of the Joule heating effect on temperature elevation, thermal stress, and energy release rate for a bi-material interface crack, but also provide practical suggestions on the optimal design of multilayered electronic devices to reduce thermal stress and prevent crack propagations.
dc.description.sponsorshipThis work was supported by the National Natural Science Foundation of China (11702199).
dc.publisherElsevier BV
dc.relation.urlhttps://linkinghub.elsevier.com/retrieve/pii/S0020768321001591
dc.rightsNOTICE: this is the author’s version of a work that was accepted for publication in International Journal of Solids and Structures. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in International Journal of Solids and Structures, [226-227, , (2021-04-30)] DOI: 10.1016/j.ijsolstr.2021.111069 . © 2021. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
dc.titleJoule heating effect on thermal stress for a bi-material interface crack
dc.typeArticle
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journalInternational Journal of Solids and Structures
dc.rights.embargodate2023-05-17
dc.eprint.versionPost-print
dc.contributor.institutionDepartment of Engineering Mechanics, School of Civil Engineering, Wuhan University, Wuhan, Hubei 430072, China
dc.identifier.volume226-227
dc.identifier.pages111069
kaust.personLiu, Yin
dc.date.accepted2021-04-23
dc.identifier.eid2-s2.0-85106223431
refterms.dateFOA2021-06-02T10:31:47Z
dc.date.published-online2021-04-30
dc.date.published-print2021-09


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