• Login
    View Item 
    •   Home
    • Office of Sponsored Research (OSR)
    • KAUST Funded Research
    • Publications Acknowledging KAUST Support
    • View Item
    •   Home
    • Office of Sponsored Research (OSR)
    • KAUST Funded Research
    • Publications Acknowledging KAUST Support
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Browse

    All of KAUSTCommunitiesIssue DateSubmit DateThis CollectionIssue DateSubmit Date

    My Account

    Login

    Quick Links

    Open Access PolicyORCID LibguidePlumX LibguideSubmit an Item

    Statistics

    Display statistics

    Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

    • CSV
    • RefMan
    • EndNote
    • BibTex
    • RefWorks
    Type
    Article
    Authors
    Oh, Seung Kyu
    Lundh, James Spencer
    Shervin, Shahab
    Chatterjee, Bikramjit
    Lee, Dong Kyu
    Choi, Sukwon
    Kwak, Joon Seop
    Ryou, Jae-Hyun
    KAUST Grant Number
    OSR-2017-CRG6-3437.02
    Date
    2019-02-25
    Permanent link to this record
    http://hdl.handle.net/10754/668072
    
    Metadata
    Show full item record
    Abstract
    GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ruggedness, and superior transient performance. However, performance and reliability are detrimentally impacted by significant heat generation in the device active area. Therefore, thermal management plays a critical role in the development of GaN-based high-power electronic and photonic devices. This paper presents a comprehensive review of the thermal management strategies for GaN-based lateral power/RF transistors and light-emitting diodes (LEDs) reported by researchers in both industry and academia. The review is divided into three parts: (1) a survey of thermal metrology techniques, including infrared thermography, Raman thermometry, and thermoreflectance thermal imaging, that have been applied to study GaN electronics and photonics; (2) practical thermal management solutions for GaN power electronics; and (3) packaging techniques and cooling systems for GaN LEDs used in automotive lighting applications.
    Citation
    Oh, S. K., Lundh, J. S., Shervin, S., Chatterjee, B., Lee, D. K., Choi, S., … Ryou, J.-H. (2019). Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications. Journal of Electronic Packaging, 141(2). doi:10.1115/1.4041813
    Sponsors
    The work at the University of Houston is supported by the IT R&D Program of Korean Ministry of Trade, Industry, and Energy (MOTIE)/Korea Evaluation Institute of Technology (KEIT) (Grant No. 10048933, Development of Epitaxial Structure Design and Epitaxial Growth System for High-Voltage Power Semiconductors) and King Abdullah University of Science and Technology (KAUST) (Contract No. OSR-2017-CRG6-3437.02). J.H.R. also acknowledges partial support from the Texas Center for Superconductivity at the University of Houston (TcSUH). The work at SCNU was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF- 2014R1A6A1030419) and the Korea Evaluation Institute of Industrial Technology, Development of Core Technologies for Transportation Systems funded by the Ministry of Trade, Industry and Energy (10070201, Development of Smart Head Lamp of VGA resolution using Micro-LED). Funding for efforts by the Pennsylvania State University was provided by the AFOSR Young Investigator Program (Grant No. FA9550-17-1-0141, Program Officers: Dr. Michael Kendra and Dr. Brett Pokines, also monitored by Dr. Kenneth Goretta).
    Publisher
    ASME International
    Journal
    Journal of Electronic Packaging
    DOI
    10.1115/1.4041813
    Additional Links
    https://asmedigitalcollection.asme.org/electronicpackaging/article/doi/10.1115/1.4041813/368415/Thermal-Management-and-Characterization-of
    ae974a485f413a2113503eed53cd6c53
    10.1115/1.4041813
    Scopus Count
    Collections
    Publications Acknowledging KAUST Support

    entitlement

     
    DSpace software copyright © 2002-2021  DuraSpace
    Quick Guide | Contact Us | KAUST University Library
    Open Repository is a service hosted by 
    Atmire NV
     

    Export search results

    The export option will allow you to export the current search results of the entered query to a file. Different formats are available for download. To export the items, click on the button corresponding with the preferred download format.

    By default, clicking on the export buttons will result in a download of the allowed maximum amount of items. For anonymous users the allowed maximum amount is 50 search results.

    To select a subset of the search results, click "Selective Export" button and make a selection of the items you want to export. The amount of items that can be exported at once is similarly restricted as the full export.

    After making a selection, click one of the export format buttons. The amount of items that will be exported is indicated in the bubble next to export format.