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    3D Antenna in Package Design: Maximizing Radiation Pattern Isotropicity and CP Coverage

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    Name:
    TAP_SUZHEN_Accepted.pdf
    Size:
    5.136Mb
    Format:
    PDF
    Description:
    Accepted manuscript
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    Type
    Conference Paper
    Authors
    Su, Z.
    Klionovski, Kirill cc
    Liao, H.
    Shamim, Atif cc
    Chen, Y.
    Elsherbeni, A.
    KAUST Department
    Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
    Electrical and Computer Engineering Program
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
    Physical Science and Engineering (PSE) Division
    Date
    2020
    Permanent link to this record
    http://hdl.handle.net/10754/667547
    
    Metadata
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    Abstract
    Near-isotropic radiation pattern and maximum CP coverage in the radiation sphere are desirable features for antennas, particularly for modern applications such as Internet of Things. In this work, we derive conditions through a combination of three dipole model and particle swarm optimization to achieve near isotropic radiation pattern and maximum CP coverage, simultaneously. Based on the developed theoretical model, a 3D antenna-in-package design provides 98% isotropicity in the radiation pattern and a CP coverage of 22.6% over the entire radiation sphere.
    Citation
    Su, Z., Klionovski, K., Liao, H., Shamim, A., Chen, Y., & Elsherbeni, A. (2020). 3D Antenna in Package Design: Maximizing Radiation Pattern Isotropicity and CP Coverage. 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting. doi:10.1109/ieeeconf35879.2020.9330011
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Conference/Event name
    2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting
    ISBN
    978-1-7281-6671-1
    DOI
    10.1109/IEEECONF35879.2020.9330011
    Additional Links
    https://ieeexplore.ieee.org/document/9330011/
    https://ieeexplore.ieee.org/document/9330011/
    https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9330011
    ae974a485f413a2113503eed53cd6c53
    10.1109/IEEECONF35879.2020.9330011
    Scopus Count
    Collections
    Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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