Solution of Coupled Hydrodynamic and Volume Integral Equations for Analyzing Electromagnetic Interactions on Nanostructures
Type
Conference PaperKAUST Department
Computational Electromagnetics LaboratoryComputer, Electrical and Mathematical Science and Engineering (CEMSE) Division
Electrical and Computer Engineering Program
King Abdullah University of Science and Technology (KAUST),Computer, Electrical, and Mathematical Science and Engineering (CEMSE),Thuwal,Saudi Arabia,23955-6900
Physical Science and Engineering (PSE) Division
Date
2020Permanent link to this record
http://hdl.handle.net/10754/667542
Metadata
Show full item recordAbstract
A coupled system of hydrodynamic and volume integral equations is solved for analyzing electromagnetic wave interactions with non-local dispersion effects on nanostructures. The proposed scheme discretizes the scatterer into a mesh of tetrahedral elements and expands (unknown) electric flux and hydrodynamic current using Schaubert-Wilton-Glisson basis functions defined on this mesh. Inserting these expansions into the coupled equations and applying Galerkin testing yield a matrix system. An iterative scheme is used to solve this matrix system for unknown expansion coefficients. Numerical results show additional resonance peaks in the scattering cross section spectrum of nanospheres, which can be explained by non-local dispersion effects accounted for by the proposed method.Citation
Uulu, D. A., Li, P., & Bagci, H. (2020). Solution of Coupled Hydrodynamic and Volume Integral Equations for Analyzing Electromagnetic Interactions on Nanostructures. 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting. doi:10.1109/ieeeconf35879.2020.9329742Conference/Event name
2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science MeetingISBN
978-1-7281-6671-1Additional Links
https://ieeexplore.ieee.org/document/9329742/https://ieeexplore.ieee.org/document/9329742/
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9329742
ae974a485f413a2113503eed53cd6c53
10.1109/IEEECONF35879.2020.9329742