Local heat energy transport analyses in gallium-indium-nitride/gallium nitride Heterostructure by microscopic Raman imaging exploiting simultaneous irradiation of two laser beams
Type
Conference PaperAuthors
Okamoto, ShungoSaito, Naomichi
Ito, Kotaro
Ma, Bei
Morita, Ken
Iida, Daisuke

Ohkawa, Kazuhiro

Ishitani, Yoshihiro
KAUST Department
Computer, Electrical and Mathematical Science and Engineering (CEMSE) DivisionElectrical and Computer Engineering Program
KAUST Grant Number
BAS/1/1676-01-01Date
2020-12-11Permanent link to this record
http://hdl.handle.net/10754/666806
Metadata
Show full item recordAbstract
Local heat transport in two GaxIn1-xN/GaN-heterostructures on sapphire substrates is investigated by microscopic Raman imaging using two lasers of 532 nm (Raman observation) and 325 nm (heat generation and Raman observation), which enables the separation of heat generation and Raman observation positions. It is found that E2(high) and A1(LO) modes of the Ga0.84In0.16N layer exhibit mutually different characteristics, which indicates the analysis of the occupation of the A1(LO) mode is available. E2(high) mode of the GaN layer observed by the 532-nm laser reveals that the transport of the heat energy generated in the Ga0.84In0.16N layer to the GaN under layer is blocked in the high-density area of misfit dislocation in the vicinity of the heterointerface.Citation
Okamoto, S., Saito, N., Ito, K., Ma, B., Morita, K., Iida, D., … Ishitani, Y. (2020). Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams. ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. doi:10.1115/ipack2020-2570Sponsors
This study was partly supported by the Grant-in-Aid for Scientific Research of the Japan Society for the Promotion of Science (16H06425 and 17H02772) and King Abdullah University of Science and Technology (KAUST) (BAS/1/1676-01-01)Publisher
ASME InternationalConference/Event name
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020ISBN
9780791884041Additional Links
https://asmedigitalcollection.asme.org/InterPACK/proceedings/InterPACK2020/84041/Virtual,%20Online/1092170ae974a485f413a2113503eed53cd6c53
10.1115/IPACK2020-2570