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    Local heat energy transport analyses in gallium-indium-nitride/gallium nitride Heterostructure by microscopic Raman imaging exploiting simultaneous irradiation of two laser beams

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    ASME_Paper_Final_rev.pdf
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    Description:
    Accepted manuscript
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    Type
    Conference Paper
    Authors
    Okamoto, Shungo
    Saito, Naomichi
    Ito, Kotaro
    Ma, Bei
    Morita, Ken
    Iida, Daisuke cc
    Ohkawa, Kazuhiro cc
    Ishitani, Yoshihiro
    KAUST Department
    Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division
    Electrical and Computer Engineering Program
    KAUST Grant Number
    BAS/1/1676-01-01
    Date
    2020-12-11
    Permanent link to this record
    http://hdl.handle.net/10754/666806
    
    Metadata
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    Abstract
    Local heat transport in two GaxIn1-xN/GaN-heterostructures on sapphire substrates is investigated by microscopic Raman imaging using two lasers of 532 nm (Raman observation) and 325 nm (heat generation and Raman observation), which enables the separation of heat generation and Raman observation positions. It is found that E2(high) and A1(LO) modes of the Ga0.84In0.16N layer exhibit mutually different characteristics, which indicates the analysis of the occupation of the A1(LO) mode is available. E2(high) mode of the GaN layer observed by the 532-nm laser reveals that the transport of the heat energy generated in the Ga0.84In0.16N layer to the GaN under layer is blocked in the high-density area of misfit dislocation in the vicinity of the heterointerface.
    Citation
    Okamoto, S., Saito, N., Ito, K., Ma, B., Morita, K., Iida, D., … Ishitani, Y. (2020). Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams. ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. doi:10.1115/ipack2020-2570
    Sponsors
    This study was partly supported by the Grant-in-Aid for Scientific Research of the Japan Society for the Promotion of Science (16H06425 and 17H02772) and King Abdullah University of Science and Technology (KAUST) (BAS/1/1676-01-01)
    Publisher
    ASME International
    Conference/Event name
    ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
    ISBN
    9780791884041
    DOI
    10.1115/IPACK2020-2570
    Additional Links
    https://asmedigitalcollection.asme.org/InterPACK/proceedings/InterPACK2020/84041/Virtual,%20Online/1092170
    ae974a485f413a2113503eed53cd6c53
    10.1115/IPACK2020-2570
    Scopus Count
    Collections
    Conference Papers; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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