Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications
Shaikh, Sohail F.
Khan, Sherjeel M.
Hussain, Muhammad Mustafa
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Nanotechnology Lab
King Abdullah University of Science and Technology,mmh Labs, Computer, Elecctrical and Mathematical Sciences and Engineering Division,Thuwal,Saudi Arabia
Online Publication Date2020-10-13
Print Publication Date2020-06
Permanent link to this recordhttp://hdl.handle.net/10754/666046
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AbstractIoT applications are increasingly becoming widespread with more stringent system requirements. In this work, we demonstrate a nature-inspired integration and packaging technology that achieves self-powered multi-functional systems with optimized performance and small footprint area. The integration technique is based on bifacial usage of the substrate where devices on both sides are interconnected via through-substrate-vias. Multiple substrates are then integrated and folded into a 3D architecture using side-interlocks following a puzzle-like fashion. On the outer sides of the 3D architecture, sensors, RF devices and energy harvesters are integrated while on the inner faces, a solid-state battery in addition to power- management and data-management circuitry are embedded. To package the system, a polymeric encapsulant is used to protect the inner circuitry and enhance the mechanical resilience of the system. Finally, the system is used to send the collected data wirelessly to a phone using an embedded Bluetooth Low Energy unit.
CitationEl-Atab, N., Suwaidan, R., Alghamdi, Y., Alhazzany, A., Almansour, R., Shaikh, S. F., … Hussain, M. M. (2020). Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications. 2020 IEEE 6th World Forum on Internet of Things (WF-IoT). doi:10.1109/wf-iot48130.2020.9221305
SponsorsThis work is supported by King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR – 2015 – Sensors - 2707 and KAUST -KFUPM Special Initiative OSR – 2016 – KKI - 2880.
Conference/Event name6th IEEE World Forum on Internet of Things, WF-IoT 2020