Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications

Abstract
IoT applications are increasingly becoming widespread with more stringent system requirements. In this work, we demonstrate a nature-inspired integration and packaging technology that achieves self-powered multi-functional systems with optimized performance and small footprint area. The integration technique is based on bifacial usage of the substrate where devices on both sides are interconnected via through-substrate-vias. Multiple substrates are then integrated and folded into a 3D architecture using side-interlocks following a puzzle-like fashion. On the outer sides of the 3D architecture, sensors, RF devices and energy harvesters are integrated while on the inner faces, a solid-state battery in addition to power- management and data-management circuitry are embedded. To package the system, a polymeric encapsulant is used to protect the inner circuitry and enhance the mechanical resilience of the system. Finally, the system is used to send the collected data wirelessly to a phone using an embedded Bluetooth Low Energy unit.

Citation
El-Atab, N., Suwaidan, R., Alghamdi, Y., Alhazzany, A., Almansour, R., Shaikh, S. F., … Hussain, M. M. (2020). Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications. 2020 IEEE 6th World Forum on Internet of Things (WF-IoT). doi:10.1109/wf-iot48130.2020.9221305

Acknowledgements
This work is supported by King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR – 2015 – Sensors - 2707 and KAUST -KFUPM Special Initiative OSR – 2016 – KKI - 2880.

Publisher
Institute of Electrical and Electronics Engineers (IEEE)

Conference/Event Name
6th IEEE World Forum on Internet of Things, WF-IoT 2020

DOI
10.1109/WF-IoT48130.2020.9221305

Additional Links
https://ieeexplore.ieee.org/document/9221305/

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