Symmetrical orientation of spiral-interconnects for high mechanical stability of stretchable electronics
Type
Conference PaperKAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) DivisionElectrical Engineering Program
Integrated Nanotechnology Lab
King Abdullah University of Science and Technology (KAUST),mmh labs, Electrical Engineering, Computer Electrical and Mathematical Science and Engineering Division,Thuwal,Saudi Arabia,23955
Date
2020-10-30Online Publication Date
2020-10-30Print Publication Date
2020-08-16Permanent link to this record
http://hdl.handle.net/10754/665814
Metadata
Show full item recordAbstract
Recently, interconnect based stretchable electronic devices have attained growing interest due to its application for various state-of-the-art technologies. Here, we report an engineered design of spiral interconnects for a series of stretchable networks referred to as the symmetrical series; wherein spirals connect to the island in the symmetry manner. A systematic analysis of Si-based spiral interconnects by numerical modeling, and experiments show that our design provides higher stretchability of 165% in comparison to the conventionally used nonsymmetrical design. The reason for high mechanical reliability is attributed to the favorable unwrapping profile of spiral interconnect due to the nature of forces acting on it during the stretching process. In contrast, for the nonsymmetrical series, the nature of tensile forces produces the rotation, and resultant tilting of spiral arm results in low stretchability of 150%. As a result, nonsymmetrical interconnect fails at earlier stages of stretching. Our study demonstrates the significance of the orientation of spiral interconnects linked to the island to attain the high performance of stretchable electronic devices.Citation
Qaiser, N., Damdam, A. N., Khan, S. M., & Hussain, M. M. (2020). Symmetrical orientation of spiral-interconnects for high mechanical stability of stretchable electronics. 2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). doi:10.1109/fleps49123.2020.9239530Conference/Event name
2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)ISBN
978-1-7281-5279-0Additional Links
https://ieeexplore.ieee.org/document/9239530/https://ieeexplore.ieee.org/document/9239530/
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9239530
ae974a485f413a2113503eed53cd6c53
10.1109/FLEPS49123.2020.9239530