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    Fully printed VO2switch based flexible and reconfigurable filter

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    Type
    Conference Paper
    Authors
    Yang, Shuai cc
    Li, Weiwei cc
    Vaseem, Mohammad
    Shamim, Atif cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
    Date
    2020-10-14
    Online Publication Date
    2020-10-14
    Print Publication Date
    2020-08
    Permanent link to this record
    http://hdl.handle.net/10754/665809
    
    Metadata
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    Abstract
    Frequency reconfigurable filters are high in demand because they can cover multiple frequency bands, thus minimizing system level cost and size requirements. Another emerging trend is the flexibility or conformability of the electronic components, so that they are suitable for mounting on non-planar objects as well as for wearable applications. In this work, we demonstrate a frequency reconfigurable bandpass filter that has been fully printed on a flexible Kapton substrate. The frequency reconfigurability has been achieved through a switch made of Metal Insulator Transition (MIT) material Vanadium-di-oxide (VO2). The VO2 switch has been printed through a custom ink. The switch is in OFF condition (insulating condition) at room temperature and turns ON (becomes conductive) at MIT temperature of 68°C. The microstrip bandpass filter employs dual mode resonators and can switch from 4.0 GHz to 3.7 GHz. The required thermal bias is provided through a printed heater which is attached to the backside of the filter. Due to the flexible Kapton substrate and the printing process, the prototype of the filter is highly flexible and low cost. Measured results are promising and in good agreement with the simulation results.
    Citation
    Yang, S., Li, W., Vaseem, M., & Shamim, A. (2020). Fully Printed VO2 Switch Based Flexible and Reconfigurable Filter. 2020 IEEE/MTT-S International Microwave Symposium (IMS). doi:10.1109/ims30576.2020.9224095
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Conference/Event name
    2020 IEEE/MTT-S International Microwave Symposium, IMS 2020
    ISBN
    9781728168159
    DOI
    10.1109/IMS30576.2020.9224095
    Additional Links
    https://ieeexplore.ieee.org/document/9224095/
    ae974a485f413a2113503eed53cd6c53
    10.1109/IMS30576.2020.9224095
    Scopus Count
    Collections
    Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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