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dc.contributor.authorQaiser, Nadeem
dc.contributor.authorDamdam, Asrar Nabil
dc.contributor.authorKhan, Sherjeel Munsif
dc.contributor.authorBunaiyan, Saleh
dc.contributor.authorHussain, Muhammad Mustafa
dc.date.accessioned2020-10-29T07:29:10Z
dc.date.available2020-10-29T07:29:10Z
dc.date.issued2020-10-27
dc.date.submitted2020-09-01
dc.identifier.citationQaiser, N., Damdam, A. N., Khan, S. M., Bunaiyan, S., & Hussain, M. M. (2020). Design Criteria for Horseshoe and Spiral-Based Interconnects for Highly Stretchable Electronic Devices. Advanced Functional Materials, 2007445. doi:10.1002/adfm.202007445
dc.identifier.issn1616-301X
dc.identifier.issn1616-3028
dc.identifier.doi10.1002/adfm.202007445
dc.identifier.doi10.1002/adfm.202170048
dc.identifier.urihttp://hdl.handle.net/10754/665700
dc.description.abstractStretchable electronics can be used for numerous advanced applications such as soft and wearable actuators, sensors, bio-implantable devices, and surgical tools because of their ability to conform to curvilinear surfaces, including human skin. The efficacy of these devices depends on the development of stretchable geometries such as interconnection-based configurations and the associated mechanics that helps to achieve optimum configurations. This work presents the essential mechanics of silicon (Si) island-interconnection structures, which include horseshoe and spiral interconnections, without reducing the areal efficiency. In particular, this study demonstrates the range of the geometrical parameters where they have a high stretchability and cyclic life. The numerical results predict the areas that are prone to breaking followed by experimental validation. The figure-of-merit for these configurations is achieved by mapping the fracture-free zones for in-plane and out-of-plane stretching with essential implications in stretchable and wearable system design. Furthermore, this work demonstrates the mechanical response for a range of materials (i.e., copper, gold, aluminum, silver, and graphene) that experience the plastic deformations in contrast to conventionally used Si-based devices that represent the extended usage for advanced stretchable electronic devices. The detailed mechanics of these configurations provides comprehensive guidelines to manufacture wearable and stretchable electronic devices.
dc.description.sponsorshipThis publication is based upon the work that was supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. REP/1/2707-01-01 and REP/1/2880-01-01.
dc.publisherWiley
dc.relation.urlhttps://onlinelibrary.wiley.com/doi/10.1002/adfm.202007445
dc.rightsArchived with thanks to Advanced Functional Materials
dc.titleDesign Criteria for Horseshoe and Spiral-Based Interconnects for Highly Stretchable Electronic Devices
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Nanotechnology Lab
dc.contributor.departmentmmh Labs Electrical Engineering Computer Electrical and Mathematical Science and Engineering Division King Abdullah University of Science and Technology (KAUST) Thuwal 23955 Saudi Arabia
dc.identifier.journalAdvanced Functional Materials
dc.rights.embargodate2021-10-28
dc.eprint.versionPost-print
dc.contributor.institutionEECS University of California Berkeley CA 94720 USA
dc.identifier.pages2007445
kaust.personQaiser, Nadeem
kaust.personDamdam, Asrar Nabil
kaust.personKhan, Sherjeel Munsif
kaust.personBunaiyan, Saleh
kaust.personHussain, Muhammad Mustafa
kaust.grant.numberREP/1/2707-01-01
kaust.grant.numberREP/1/2880-01-01
dc.date.accepted2020-10-16
refterms.dateFOA2020-11-01T06:00:07Z
kaust.acknowledged.supportUnitOffice of Sponsored Research (OSR)
dc.date.published-online2020-10-27
dc.date.published-print2021-02


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