DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method with Thermal Effects Incorporated
Type
ArticleKAUST Department
Computational Electromagnetics LaboratoryComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Date
2020-05-13Online Publication Date
2020-05-13Print Publication Date
2020-06Permanent link to this record
http://hdl.handle.net/10754/662835
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Due to the temperature dependent resistivity of power delivery network (PDN) interconnects, a wiser and necessary strategy is to proceed the electrical-thermal co-simulation in order to include the thermal effects caused by Joule Heating. As a natural domain decomposition method (DDM), in this work, a discontinuous Galerkin (DG) method is proposed to facilitate the steady-state electrical and thermal co-analysis. With the intention to avoid solving a globally coupled steady-state matrix system equations resulted by the implicit numerical flux in DG, the block Thomas method is deployed to solve the entire domain in a subdomain by subdomain scheme. As a direct solver, the block Thomas method is free of convergence problem frequently occurring in iterative methods such as block Gauss-Seidel method. The capability of the proposed DG method in handling multiscale and complex 3D PDNs is validated by several representative examples.Citation
Li, P., Tang, M., Huang, Z. X., Jiang, L. J., & Bagci, H. (2020). DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method with Thermal Effects Incorporated. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1–1. doi:10.1109/tcpmt.2020.2992925Sponsors
This work is supported by National Natural Science Foundation of China (NSFC) under Grant 61701423, 61674105, 61831016, 61722101, 61701424, and in part by National Key Research and Development Program of China under Grant 2019YFB1802904 and 2019YFB2205001Additional Links
https://ieeexplore.ieee.org/document/9092985/https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9092985
ae974a485f413a2113503eed53cd6c53
10.1109/TCPMT.2020.2992925
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