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dc.contributor.authorBu Khamsin, Abdullah
dc.contributor.authorMoussi, Khalil
dc.contributor.authorPatel, Niketan Sarabhai
dc.contributor.authorPrzybysz, Alexander
dc.contributor.authorWang, Yajun
dc.contributor.authorKrattinger, Simon G.
dc.contributor.authorKosel, Jürgen
dc.date.accessioned2020-04-23T10:39:25Z
dc.date.available2020-04-23T10:39:25Z
dc.date.issued2020-04-07
dc.identifier.citationBukhamsin, A., Moussi, K., Patel, N., Przybysz, A., Wang, Y., Krattinger, S., & Kosel, J. (2020). Impedimetric Plant Biosensor Based on Minimally Invasive and Flexible Microneedle Electrodes. 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS). doi:10.1109/mems46641.2020.9056158
dc.identifier.isbn9781728135809
dc.identifier.issn1084-6999
dc.identifier.doi10.1109/MEMS46641.2020.9056158
dc.identifier.urihttp://hdl.handle.net/10754/662622
dc.description.abstractThis paper presents an impedimetric biosensor for monitoring of crops using novel microneedle electrodes for minimally invasive, sensitive measurements, compatible with smart agriculture developments. The biosensor was fabricated through polydimethylsiloxane imprinting using a high-resolution 3D printed negative mold. This method allows for fabrication of tailored microneedles with heights up to 500μm, required to penetrate through the epidermis of a leaf. The sensor was tested by recording the bioimpedance of Barely leaves and comparing its performance to conventional planar and needle electrodes. Furthermore, we present evidence of a diurnal pattern in plant bioimpedance that was detected by monitoring the leaf bioimpedance under controlled conditions.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.urlhttps://ieeexplore.ieee.org/document/9056158/
dc.rightsArchived with thanks to IEEE
dc.titleImpedimetric Plant Biosensor Based on Minimally Invasive and Flexible Microneedle Electrodes
dc.typeConference Paper
dc.contributor.departmentBiological and Environmental Sciences and Engineering (BESE) Division
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentPlant Science
dc.contributor.departmentSensing, Magnetism and Microsystems Lab
dc.conference.date2020-01-18 to 2020-01-22
dc.conference.name33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
dc.conference.locationVancouver, BC, CAN
dc.eprint.versionPost-print
dc.identifier.volume2020-January
dc.identifier.pages307-310
kaust.personBu Khamsin, Abdullah
kaust.personMoussi, Khalil
kaust.personPatel, Niketan Sarabhai
kaust.personPrzybysz, Alexander
kaust.personWang, Yajun
kaust.personKrattinger, Simon G.
kaust.personKosel, Jürgen
dc.identifier.eid2-s2.0-85083193100
refterms.dateFOA2020-04-23T11:08:02Z
dc.date.published-online2020-04-07
dc.date.published-print2020-01


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