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    Impedimetric Plant Biosensor Based on Minimally Invasive and Flexible Microneedle Electrodes

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    Thumbnail
    Name:
    MEMS 2020- AbdullahBukhamsin.pdf
    Size:
    473.4Kb
    Format:
    PDF
    Description:
    Accepted manuscript
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    Type
    Conference Paper
    Authors
    Bu Khamsin, Abdullah cc
    Moussi, Khalil cc
    Patel, Niketan Sarabhai cc
    Przybysz, Alexander
    Wang, Yajun cc
    Krattinger, Simon G. cc
    Kosel, Jürgen cc
    KAUST Department
    Biological and Environmental Sciences and Engineering (BESE) Division
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering
    Electrical Engineering Program
    Plant Science
    Sensing, Magnetism and Microsystems Lab
    Date
    2020-04-07
    Online Publication Date
    2020-04-07
    Print Publication Date
    2020-01
    Permanent link to this record
    http://hdl.handle.net/10754/662622
    
    Metadata
    Show full item record
    Abstract
    This paper presents an impedimetric biosensor for monitoring of crops using novel microneedle electrodes for minimally invasive, sensitive measurements, compatible with smart agriculture developments. The biosensor was fabricated through polydimethylsiloxane imprinting using a high-resolution 3D printed negative mold. This method allows for fabrication of tailored microneedles with heights up to 500μm, required to penetrate through the epidermis of a leaf. The sensor was tested by recording the bioimpedance of Barely leaves and comparing its performance to conventional planar and needle electrodes. Furthermore, we present evidence of a diurnal pattern in plant bioimpedance that was detected by monitoring the leaf bioimpedance under controlled conditions.
    Citation
    Bukhamsin, A., Moussi, K., Patel, N., Przybysz, A., Wang, Y., Krattinger, S., & Kosel, J. (2020). Impedimetric Plant Biosensor Based on Minimally Invasive and Flexible Microneedle Electrodes. 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS). doi:10.1109/mems46641.2020.9056158
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Conference/Event name
    33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
    ISBN
    9781728135809
    DOI
    10.1109/MEMS46641.2020.9056158
    Additional Links
    https://ieeexplore.ieee.org/document/9056158/
    ae974a485f413a2113503eed53cd6c53
    10.1109/MEMS46641.2020.9056158
    Scopus Count
    Collections
    Conference Papers; Biological and Environmental Science and Engineering (BESE) Division; Electrical and Computer Engineering Program; Sensing, Magnetism and Microsystems Lab; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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