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dc.contributor.authorShamim, Atif
dc.contributor.authorZhang, Haoran
dc.date.accessioned2020-04-01T13:05:10Z
dc.date.available2020-04-01T13:05:10Z
dc.date.issued2020-03-06
dc.identifier.citationShamim, A., & Zhang, H. (2020). Antenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms. Antenna-in-Package Technology and Applications, 147–178. doi:10.1002/9781119556671.ch6
dc.identifier.isbn9781119556633
dc.identifier.isbn9781119556671
dc.identifier.doi10.1002/9781119556671.ch6
dc.identifier.urihttp://hdl.handle.net/10754/662415
dc.description.abstractAntenna-in-package (AiP) is an antenna that is realized on the package of the driving circuit. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. It discusses LTCC technology, before moving on to details of AiP design. LTCC technology is highly suitable for substrate-integrated waveguide-based antennas. This is because LTCC is a multilayered technology in which conductive vias are an integral part of the fabrication process. One of the main challenges blocking the widespread LTCC-based AiPs use is the improvement of LTCC fabrication resolution and repeatability. LTCC technology can use low-loss conductors for the metallization steps because the multilayered LTCC tapes are laminated and co-fired at relatively low temperatures.
dc.publisherWiley
dc.relation.urlhttps://onlinelibrary.wiley.com/doi/abs/10.1002/9781119556671.ch6
dc.rightsArchived with thanks to Wiley
dc.titleAntenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms
dc.typeBook Chapter
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
dc.eprint.versionPost-print
dc.identifier.pages147-178
kaust.personShamim, Atif
kaust.personZhang, Haoran
refterms.dateFOA2020-04-05T05:19:12Z
dc.date.published-online2020-03-06
dc.date.published-print2020-04-07


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