Antenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms
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LTCC AiP (Book Chapter 6).pdf
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2.253Mb
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PDF
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Accepted manuscript
Type
Book ChapterAuthors
Shamim, Atif
Zhang, Haoran

KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) DivisionElectrical Engineering
Electrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Date
2020-03-06Online Publication Date
2020-03-06Print Publication Date
2020-04-07Permanent link to this record
http://hdl.handle.net/10754/662415
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Show full item recordAbstract
Antenna-in-package (AiP) is an antenna that is realized on the package of the driving circuit. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. It discusses LTCC technology, before moving on to details of AiP design. LTCC technology is highly suitable for substrate-integrated waveguide-based antennas. This is because LTCC is a multilayered technology in which conductive vias are an integral part of the fabrication process. One of the main challenges blocking the widespread LTCC-based AiPs use is the improvement of LTCC fabrication resolution and repeatability. LTCC technology can use low-loss conductors for the metallization steps because the multilayered LTCC tapes are laminated and co-fired at relatively low temperatures.Citation
Shamim, A., & Zhang, H. (2020). Antenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms. Antenna-in-Package Technology and Applications, 147–178. doi:10.1002/9781119556671.ch6Publisher
WileyISBN
97811195566339781119556671
Additional Links
https://onlinelibrary.wiley.com/doi/abs/10.1002/9781119556671.ch6ae974a485f413a2113503eed53cd6c53
10.1002/9781119556671.ch6