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    Antenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms

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    Name:
    LTCC AiP (Book Chapter 6).pdf
    Size:
    2.253Mb
    Format:
    PDF
    Description:
    Accepted manuscript
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    Type
    Book Chapter
    Authors
    Shamim, Atif cc
    Zhang, Haoran cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering
    Electrical Engineering Program
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
    Date
    2020-03-06
    Online Publication Date
    2020-03-06
    Print Publication Date
    2020-04-07
    Permanent link to this record
    http://hdl.handle.net/10754/662415
    
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    Abstract
    Antenna-in-package (AiP) is an antenna that is realized on the package of the driving circuit. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. It discusses LTCC technology, before moving on to details of AiP design. LTCC technology is highly suitable for substrate-integrated waveguide-based antennas. This is because LTCC is a multilayered technology in which conductive vias are an integral part of the fabrication process. One of the main challenges blocking the widespread LTCC-based AiPs use is the improvement of LTCC fabrication resolution and repeatability. LTCC technology can use low-loss conductors for the metallization steps because the multilayered LTCC tapes are laminated and co-fired at relatively low temperatures.
    Citation
    Shamim, A., & Zhang, H. (2020). Antenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms. Antenna-in-Package Technology and Applications, 147–178. doi:10.1002/9781119556671.ch6
    Publisher
    Wiley
    ISBN
    9781119556633
    9781119556671
    DOI
    10.1002/9781119556671.ch6
    Additional Links
    https://onlinelibrary.wiley.com/doi/abs/10.1002/9781119556671.ch6
    ae974a485f413a2113503eed53cd6c53
    10.1002/9781119556671.ch6
    Scopus Count
    Collections
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical and Computer Engineering Program; Book Chapters; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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