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dc.contributor.authorChen, Qiaoli
dc.contributor.authorDwyer, Christian
dc.contributor.authorSheng, Guan
dc.contributor.authorZhu, Chongzhi
dc.contributor.authorLi, Xiaonian
dc.contributor.authorZheng, Changlin
dc.contributor.authorZhu, Yihan
dc.date.accessioned2020-03-01T10:40:46Z
dc.date.available2020-03-01T10:40:46Z
dc.date.issued2020-02-28
dc.date.submitted2019-11-20
dc.identifier.citationChen, Q., Dwyer, C., Sheng, G., Zhu, C., Li, X., Zheng, C., & Zhu, Y. (2020). Imaging Beam-Sensitive Materials by Electron Microscopy. Advanced Materials, 1907619. doi:10.1002/adma.201907619
dc.identifier.doi10.1002/adma.201907619
dc.identifier.urihttp://hdl.handle.net/10754/661821
dc.description.abstractElectron microscopy allows the extraction of multidimensional spatiotemporally correlated structural information of diverse materials down to atomic resolution, which is essential for figuring out their structure-property relationships. Unfortunately, the high-energy electrons that carry this important information can cause damage by modulating the structures of the materials. This has become a significant problem concerning the recent boost in materials science applications of a wide range of beam-sensitive materials, including metal-organic frameworks, covalent-organic frameworks, organic-inorganic hybrid materials, 2D materials, and zeolites. To this end, developing electron microscopy techniques that minimize the electron beam damage for the extraction of intrinsic structural information turns out to be a compelling but challenging need. This article provides a comprehensive review on the revolutionary strategies toward the electron microscopic imaging of beam-sensitive materials and associated materials science discoveries, based on the principles of electron-matter interaction and mechanisms of electron beam damage. Finally, perspectives and future trends in this field are put forward.
dc.description.sponsorshipY.Z. acknowledges the financial support from the National Natural Science Foundation of China (Grant Nos. 21771161 and 51701181), the Zhejiang Provincial Natural Science Foundation of China (Grant No. LR18B030003), and Thousand Talents Program for Distinguished Young Scholars. C.Z. acknowledges the financial support from the National Natural Science Foundation of China (Grant No. 61871134), Shanghai Municipal Science and Technology Commission (Grant No. 18JC1410300), and Fudan University Scientific Research Foundation (IDH1512043). C.D. acknowledges the financial support from the National Science Foundation (Grant Nos. 1936882 and DMR-1920335) and is grateful for Fudan University Key Laboratory Visiting Fellowship (Grant No. GF2019_05). The authors thank Y. Yao from Beijing National Laboratory for Condensed Matter Physics for useful discussions.
dc.publisherWiley
dc.relation.urlhttps://onlinelibrary.wiley.com/doi/abs/10.1002/adma.201907619
dc.rightsArchived with thanks to Advanced materials (Deerfield Beach, Fla.)
dc.titleImaging Beam-Sensitive Materials by Electron Microscopy.
dc.typeArticle
dc.contributor.departmentChemical Engineering
dc.contributor.departmentChemical Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journalAdvanced materials (Deerfield Beach, Fla.)
dc.rights.embargodate2021-03-01
dc.eprint.versionPost-print
dc.contributor.institutionCenter for Electron Microscopy, State Key Laboratory Breeding Base of Green Chemistry Synthesis Technology and College of Chemical Engineering, Zhejiang University of Technology, Hangzhou, 310014, China.
dc.contributor.institutionDepartment of Physics, Arizona State University, Tempe, AZ, 85287-1504, USA.
dc.contributor.institutionState Key Laboratory of Surface Physics and Department of Physics, Fudan University, Shanghai, 200438, China.
kaust.personSheng, Guan
dc.date.accepted2019-12-20
dc.date.published-online2020-02-28
dc.date.published-print2020-04


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