Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration
KAUST DepartmentElectrical Engineering Program
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Online Publication Date2019-11-05
Print Publication Date2019-11
Permanent link to this recordhttp://hdl.handle.net/10754/660445
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AbstractThe twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
CitationHong, W., Maaskant, R., Liu, D., Wang, H., Shamim, A., Smolders, B., … Zhang, Y. (2019). Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration. IEEE Antennas and Wireless Propagation Letters, 18(11), 2345–2350. doi:10.1109/lawp.2019.2945829
SponsorsThis Special Cluster would not have been possible without spectacular teamwork. The guest editors sincerely express their gratitude to Prof. C. Fumeaux, the Editor-in-Chief of the IEEE Antennas and Propagation Letters, for his encouragement, consultation, and trust. In addition, we thank C. Sideri, the Editorial Assistant for her prompt support. In addition, the guest editors immensely thank all the authors who have contributed during the submission process for their enthusiasm and effort. Finally, yet importantly, we thank the reviewers for upholding the quality of this Special Cluster, which would not have been possible without their magnificent devotion.