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Jin_et_al-2019-Angewandte_Chemie_International_Edition.pdf
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Type
ArticleAuthors
Jin, HuileLi, Jun
Iocozzia, James
Zeng, Xin
Wei, Pai-Chun
Yang, Chao
Li, Nan
Liu, Zhaoping
He, Jr-Hau

Zhu, Tiejun
Wang, Jichang
Lin, Zhiqun
Wang, Shun
KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) DivisionElectrical Engineering Program
KAUST Solar Center (KSC)
Date
2019-07-04Embargo End Date
2020-01-01Permanent link to this record
http://hdl.handle.net/10754/656364
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Show full item recordAbstract
Hybrid organic–inorganic materials have been considered as a new candidate in the field of thermoelectric materials since the last decade owing to their great potential to enhance the thermoelectric performance by utilizing the low thermal conductivity of organic materials and the high Seebeck coefficient, and high electrical conductivity of inorganic materials. Herein, we provide an overview of interfacial engineering in the synthesis of various organic–inorganic thermoelectric hybrid materials, along with the dimensional design for tuning their thermoelectric properties. Interfacial effects are examined in terms of nanostructures, physical properties, and chemical doping between the inorganic and organic components. Several key factors which dictate the thermoelectric efficiency and performance of various electronic devices are also discussed, such as the thermal conductivity, electric transportation, electronic band structures, and band convergence of the hybrid materials.Citation
Jin, H., Li, J., Iocozzia, J., Zeng, X., Wei, P.-C., Yang, C., … Wang, S. (2019). Hybrid Organic-Inorganic Thermoelectric Materials and Devices. Angewandte Chemie International Edition. doi:10.1002/anie.201901106Sponsors
We are grateful for financial support from the National Natural Science Foundation of China (51772219, 51872209, 21471116, 21628102, and 61728403), the Zhejiang Provincial Natural Science Foundation of China (LZ18E030001, LZ17E020002 and LZ15E020002).Publisher
Wiley-VCH VerlagAdditional Links
http://doi.wiley.com/10.1002/anie.201901106ae974a485f413a2113503eed53cd6c53
10.1002/anie.201901106