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High Q, miniaturized LCP-based passive components, and filter design for SoP applications

dc.contributor.authorArabi, Eyad A.
dc.contributor.authorShamim, Atif
dc.date.accessioned2019-07-21T10:46:40Z
dc.date.available2019-07-21T10:46:40Z
dc.date.issued2011-12-15
dc.identifier.doi10.23919/EuMC.2011.6101917
dc.identifier.urihttp://hdl.handle.net/10754/656121
dc.description.abstractIn this paper, for the first time, a library of completely embedded multi-layer capacitors and inductors designed in a custom adhessiveless multi-layer liquid crystal polymers (M-LCP) process is presented. High Q-factor spiral inductors (Q of 150 @ 8 GHz), and vertical interdigitized (VID) capacitors are demonstrated. As a proof of concept, two highpass filters are designed using the presented library. A size reduction of around 80% is achieved as compared to planar implementations, which highlights the miniaturization capabilities of the M-LCP technology. The miniaturized filter has an insertion loss of 0.2 dBs @ 3GHz.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.urlhttps://ieeexplore.ieee.org/document/6101917/
dc.relation.urlhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6101917
dc.rights(c) 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. Released under the IEEE Open Access Publishing Agreement.
dc.subjectLCP
dc.subjectInductors
dc.subjectCapacitors
dc.subjectSystem on Package (SoP)
dc.subjectPassives
dc.subjectMulti-layer
dc.titleHigh Q, miniaturized LCP-based passive components, and filter design for SoP applications
dc.typeConference Paper
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
dc.contributor.departmentOffice of the VP
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.conference.date10-13 Oct. 2011
dc.conference.name2011 41st European Microwave Conference
dc.conference.locationManchester
dc.eprint.versionPost-print
kaust.personArabi, Eyad A.
kaust.personShamim, Atif


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