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    Numerical modeling of PCB power/ground plate-pairs by DGTD method taking into account decoupling capacitors

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    Type
    Conference Paper
    Authors
    Li, Ping
    Jiang, Li Jun
    Bagci, Hakan cc
    KAUST Department
    Computational Electromagnetics Laboratory
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Date
    2018-02-01
    Online Publication Date
    2018-02-01
    Print Publication Date
    2017-12
    Permanent link to this record
    http://hdl.handle.net/10754/631528
    
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    Abstract
    A discontinuous Galerkin time-domain (DGTD) method is proposed in this work to analyze printed circuit board (PCB) power/ground plate-pair having arbitrarily shaped anti-pads. To apply proper excitation source over the irregular anti-pad, the implemented wave port magnetic current excitation is expanded by the electric eigen-modes of the anti-pad that are calculated via either numerical approach or analytical method. Based on the orthogonality of eigen-modes, the temporal mode expansion coefficient for each mode can be conveniently extracted. Besides, considering the presence of decoupling capacitors, the whole physical system can be split into field and circuit subsystems. For the field subsystem, it is governed by the Maxwell's equations, thus it will be solved by DGTD method. For the circuit subsystem, the modified nodal analysis (MNA) is applied. In order to achieve the coupling between the field and circuit subsystems, a lumpled port is defined at the interface between the field and circuit subsystems. To verify the proposed algorithm, several representative examples are benchmarked.
    Citation
    Li P, Jiang LJ, Bagci H (2017) Numerical modeling of PCB power/ground plate-pairs by DGTD method taking into account decoupling capacitors. 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). Available: http://dx.doi.org/10.1109/EDAPS.2017.8276909.
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
    Conference/Event name
    2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
    DOI
    10.1109/EDAPS.2017.8276909
    Additional Links
    https://ieeexplore.ieee.org/document/8276909
    ae974a485f413a2113503eed53cd6c53
    10.1109/EDAPS.2017.8276909
    Scopus Count
    Collections
    Conference Papers; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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