Rapid photonic curing of solution-processed In2O3 layers on flexible substrates
KAUST DepartmentKAUST Solar Center (KSC)
Material Science and Engineering Program
Physical Science and Engineering (PSE) Division
Online Publication Date2019-02-10
Print Publication Date2019-06
Permanent link to this recordhttp://hdl.handle.net/10754/631055
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AbstractIn2O3 is one of the most important semiconducting metal oxides primarily because of its wide band gap, high electron mobility and processing versatility. To this end, high-quality thin films of In2O3 can be prepared using scalable and inexpensive solution-based deposition methods, hence making it attractive for application in a number of emerging electronic applications. However, traditional solution processing often requires high temperature and lengthy annealing steps, making it impossible to use in combination with temperature-sensitive plastic substrates, which would be desired for numerous emerging flexible device applications. Here, rapid photonic curing of In2O3 layers is explored as an alternative to thermal annealing. Oxide thin films are successfully prepared on a range of substrates, including glass, polyimide, and polyethylene naphthalate. The effect of substrate and post-processing treatment on the morphology, surface chemistry, and electronic properties is investigated by atomic force microscopy and X-ray photoelectron spectroscopy. Systematic trends are identified, particularly in the degree of conversion of the precursor and its influence on the electronic structure.
CitationTwyman NM, Tetzner K, Anthopoulos TD, Payne DJ, Regoutz A (2019) Rapid photonic curing of solution-processed In2O3 layers on flexible substrates. Applied Surface Science. Available: http://dx.doi.org/10.1016/j.apsusc.2019.02.038.
SponsorsThis work was supported by the Engineering and Physical Sciences Research Council (EPSRC) (Grant No. EP/M028291/1). A.R. acknowledges the support from Imperial College London for her Imperial College Research Fellowship. K.T. acknowledges the financial support from the People Programme (Marie Curie Actions) of the European Union's Framework Programme Horizon 2020: “Flexible Complementary Hybrid Integrated Circuits” (FlexCHIC), Grant Agreement No. 658563. D.-J. P. acknowledges support from the Royal Society for a University Research Fellowship (Grant Nos. UF100105 and UF150693). T.D.A. acknowledges the King Abdullah University of Science and Technology (KAUST) for the financial support. Thanks go to Averey Chan for helpful discussion of the manuscript.
JournalApplied Surface Science