Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity
KAUST DepartmentCleanroom Operations
Imaging and Characterization Core Lab
Nanofabrication Core Lab
Thin Films & Characterization
Online Publication Date2018-12-31
Print Publication Date2018-09
Permanent link to this recordhttp://hdl.handle.net/10754/630935
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AbstractHigh density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. Here, a novel highly thermal conductive and lightweight graphene based thermal interface materials (GT) was developed for thermal management in power devices. Composed by vertically graphene structures, GTs provide a continuous high thermal conductivity phase along the path of thermal transport, which lead to outstanding thermal properties. The highest through-plane thermal conductivity GTs reaches to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium by over ten times. In addition, a thin layer of indium metal that coated on the surface of GTs can easily form alloys with many other metals at a relatively low reflow temperature. Therefore, GTs, as an excellent TIM, can provide complete physical contact between two surfaces with minimized the contact resistance. The measured total thermal resistance and effective thermal conductivity by using 300 m thick GTs as TIM between two copper blocks reaches to ~ 3.7 Kmm2 /W and ~ 90 W/mK, respectively. Such values are significantly higher than the randomly dispersed composites presented above, and show even better thermal performance than pure indium bonding. In addition, GTs has more advantages than pure indium bonding, including low weight (density < 2 g/cm3), low complexity during assembly and maintainability. The resulting GTs thus opens new opportunities for addressing large heat dissipation issues in form-factor driven electronics and other high power driven systems.
CitationWang N, Chen S, Nkansah A, Wang Q, Wang X, et al. (2018) Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity. 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Available: http://dx.doi.org/10.1109/therminic.2018.8593303.
SponsorsWe thank for the financial support from the Swedish Foundation for Strategic Research (SSF) under contract (Nos SE13–0061, GMT14–0045), Swedish National Board for Innovation (Vinnova) Graphene SIO-Agenda Program, Formas program on graphene enhanced composite as well as from the Production Area of Advance at Chalmers University of Technology, Sweden. Thanks for the financial support by the Ministry of Science and Technology of China with the contract No: YS2017YFGX020059 and Shanghai Municipal Education Commission (Shanghai University High Education Peak Discipline Program).