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    Stretchability of Archimedean-Spiral Interconnects Design

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    Type
    Conference Paper
    Authors
    Alcheikh, Nouha
    Hussain, Mohammad
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Physical Science and Engineering (PSE) Division
    Utilities Maintenance
    Date
    2018-12-13
    Online Publication Date
    2018-12-13
    Print Publication Date
    2018-04
    Permanent link to this record
    http://hdl.handle.net/10754/630706
    
    Metadata
    Show full item record
    Abstract
    The island-interconnects design represents one of the categories which is widely used in stretchable electronics. Recently, Archimedean spiral interconnects are proposed as one of the best solutions for achieving a high level of stretchability. According to existing studies, their shape designs need to be investigated. Hence, this paper aims to examine the effect of the shape and the geometrical parameters of the Archimedean spiral on their stretchability. Due to the complex geometry, we use finite element method (FEM) to calculate the maximum stress and strain under axial deformation. The results conclude that with a narrow width and larger height, the Archimedean spiral shows highly stretchability more than 277% and 440% under maximum tensile strain εmax=1% and εmax=1.7%, respectively which correspond to the critical intrinsic strain of silicon. These results can be promising to fabricate high stretchable Archimedean spiral interconnects.
    Citation
    Alcheikh N, Hussain MM (2018) Stretchability of Archimedean-Spiral Interconnects Design. 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). Available: http://dx.doi.org/10.1109/nems.2018.8556891.
    Sponsors
    We gratefully acknowledge KAUST for funding this project.
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
    DOI
    10.1109/nems.2018.8556891
    Additional Links
    https://ieeexplore.ieee.org/document/8556891
    ae974a485f413a2113503eed53cd6c53
    10.1109/nems.2018.8556891
    Scopus Count
    Collections
    Conference Papers; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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