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dc.contributor.authorLi, Ping
dc.contributor.authorJiang, Lijun
dc.contributor.authorXiong, Xiaoyan
dc.contributor.authorBagci, Hakan
dc.date.accessioned2018-12-31T13:57:39Z
dc.date.available2018-12-31T13:57:39Z
dc.date.issued2018-11-16
dc.identifier.citationLi P, Jiang L, Xiong X, Bagci H (2018) A New Efficient Domain Decomposition Method for Highly Irregular Via Patterns. 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). Available: http://dx.doi.org/10.1109/epeps.2018.8534309.
dc.identifier.doi10.1109/epeps.2018.8534309
dc.identifier.urihttp://hdl.handle.net/10754/630631
dc.description.abstractIn the high-speed signal path on PCB and packagings, vias usually causes most discontinuities and thereby crosstalks. In simulation and characterizations, they also generate more errors than the trace parts due to rich modes around them. To achieve both efficiency and accuracy, in this paper, a new domain decomposition based finite element time domain (FETD) method is proposed for the analysis of power/ground plate pairs with various types of antipads. Using the magnetic field feature, the 3D computational domain is firstly represented by a quasi-2D field. Then by taking advantage of the fast decaying property of high order modes, the quasi-2D FETD is further simplified to a hybrid 2D/quasi-2D algorithm. Assisted by the wave-port excitation and its S-parameter extraction technique, irregularly shaped antipads of complex via patterns are benchmarked to demonstrate the accuracy and efficiency of the proposed algorithm.
dc.description.sponsorshipThis work was supported in part by the Research Grants Council of Hong Kong (GRF 17207114 and GRF 17210815), AOARD FA2386-17-1-0010, NSFC 61271158, and Hong Kong UGC AoE/P-04/08.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.urlhttps://ieeexplore.ieee.org/document/8534309
dc.subjectFETD
dc.subjectDomain Decomposition
dc.subjectAntipads
dc.subjectVia Patterns
dc.subjectquasi-2D
dc.titleA New Efficient Domain Decomposition Method for Highly Irregular Via Patterns
dc.typeConference Paper
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journal2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
dc.contributor.institutionDept. of EEE, University of Hong Kong, Hong Kong
dc.contributor.institutionZJU-UIUC Institute, International Campus, Zhejiang University, China
kaust.personBagci, Hakan
dc.date.published-online2018-11-16
dc.date.published-print2018-10


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