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    Miniaturized, low power, wireless transmitter and receiver with on-chip antenna, and wireless coupling of on-chip and off-chip antenna

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    Name:
    US20100099367A1.pdf
    Size:
    3.595Mb
    Format:
    PDF
    Description:
    Patent
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    Type
    Patent
    Patent Status
    Granted Patent
    Authors
    Shamim, Atif cc
    Arsalan, Muhammad
    Roy, Langis
    Assignee
    Shamim Atif
    Arsalan Muhammad
    Langis Roy
    King Abdullah University of Science and Technology (KAUST)
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
    Physical Science and Engineering (PSE) Division
    Date
    2010-04-22
    Submitted Date
    2009-10-16
    Permanent link to this record
    http://hdl.handle.net/10754/630358
    
    Metadata
    Show full item record
    Abstract
    A miniaturized, low power RF transmitter with a dual mode active on-chip antenna/inductor is disclosed in which antenna also serves as the oscillator inductor. Also disclosed is a miniaturized low power RF receiver with an on-chip antenna; and a RF transmitter system wherein an on-chip antenna is wirelessly coupled to an off chip patch antenna are disclosed. Advantageously, the TX chip is housed in a low loss, e.g. Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna to provide a System-on-Package implementation comprising electromagnetic coupling between a RF TX chip comprising an integrated on-chip antenna and a package antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines, and significantly increases the gain and range of the module with respect to the on-chip antenna alone, without deterioration of the circuit performance and power consumption. Exemplary embodiments are disclosed which may be fabricated using standard CMOS technology, for operation in the 5 GHz U-NII band for applications such as miniaturized, low cost, low power wireless devices and sensor systems.
    Patent Number
    US8412290B2
    Application Number
    US20100099367A1
    Additional Links
    https://patents.google.com/patent/US20100099367A1/en
    Collections
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Patents; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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