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dc.contributor.authorGiancola, Silvio
dc.contributor.authorValenti, Matteo
dc.contributor.authorSala, Remo
dc.date.accessioned2018-11-19T11:13:35Z
dc.date.available2018-11-19T11:13:35Z
dc.date.issued2018-06-19
dc.identifier.citationGiancola S, Valenti M, Sala R (2018) A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies. Available: http://dx.doi.org/10.1007/978-3-319-91761-0.
dc.identifier.issn2191-5768
dc.identifier.issn2191-5776
dc.identifier.doi10.1007/978-3-319-91761-0
dc.identifier.urihttp://hdl.handle.net/10754/629906
dc.description.abstractThis book is a valuable resource to deeply understand the technology used in 3D cameras. In this book, the authors summarize and compare the specifications of the main 3D cameras available in the mass market. The authors present a deep metrological analysis of the main camera based on the three main technologies: Time-of-Flight, Structured-Light and Active Stereoscopy, and provide qualitative results for any user to understand the underlying technology within 3D camera, as well as practical guidance on how to get the most of them for a given application.
dc.publisherSpringer Nature
dc.relation.urlhttps://link.springer.com/chapter/10.1007%2F978-3-319-91761-0
dc.titleA Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies
dc.typeBook
dc.contributor.departmentVisual Computing Center (VCC)
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.identifier.journalSpringerBriefs in Computer Science
dc.contributor.institutionPolytechnic University of Milan, Milan, , Italy
dc.contributor.institutionMechanical Engineering Department, Polytechnic University of Milan, Milan, , Italy
kaust.personGiancola, Silvio
refterms.dateFOA2019-08-27T06:55:49Z
dc.date.published-online2018-06-19
dc.date.published-print2018


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