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dc.contributor.authorLi, Ping
dc.contributor.authorJiang, Li Jun
dc.contributor.authorBagci, Hakan
dc.date.accessioned2018-04-16T11:27:41Z
dc.date.available2018-04-16T11:27:41Z
dc.date.issued2018-04-06
dc.identifier.citationLi P, Jiang LJ, Bagci H (2017) Discontinuous Galerkin time-domain analysis of power/ground plate pairs with wave port excitation. 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). Available: http://dx.doi.org/10.1109/epeps.2017.8329717.
dc.identifier.doi10.1109/epeps.2017.8329717
dc.identifier.urihttp://hdl.handle.net/10754/627498
dc.description.abstractIn this work, a discontinuous Galerkin time-domain method is developed to analyze the power/ground plate pairs taking into account arbitrarily shaped antipads. To implement proper source excitations over the antipads, the magnetic surface current expanded by the electric eigen-modes supported by the corresponding antipad is employed as the excitation. For irregularly shaped antipads, the eigen-modes are obtained by numerical approach. Accordingly, the methodology for the S-parameter extraction is derived based on the orthogonal properties of the different modes. Based on the approach, the transformation between different modes can be readily evaluated.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.urlhttps://ieeexplore.ieee.org/document/8329717/
dc.rights(c) 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
dc.titleDiscontinuous Galerkin time-domain analysis of power/ground plate pairs with wave port excitation
dc.typeConference Paper
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journal2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
dc.eprint.versionPost-print
dc.contributor.institutionDepartment of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong
kaust.personBagci, Hakan
refterms.dateFOA2018-06-14T04:19:44Z
dc.date.published-online2018-04-06
dc.date.published-print2017-10


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