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Interfacial reactions in thermoelectric modules

dc.contributor.authorWu, Hsin-jay
dc.contributor.authorWu, Albert T.
dc.contributor.authorWei, Pei-chun
dc.contributor.authorChen, Sinn-wen
dc.date.accessioned2018-02-27T09:00:11Z
dc.date.available2018-02-27T09:00:11Z
dc.date.issued2018-02-20
dc.identifier.citationWu H, Wu AT, Wei P, Chen S (2018) Interfacial reactions in thermoelectric modules. Materials Research Letters 6: 244–248. Available: http://dx.doi.org/10.1080/21663831.2018.1436092.
dc.identifier.issn2166-3831
dc.identifier.doi10.1080/21663831.2018.1436092
dc.identifier.urihttp://hdl.handle.net/10754/627196
dc.description.abstractEngineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well.
dc.description.sponsorshipThe authors acknowledge the financial support from the Ministry of Science and Technology, Taiwan [grant number 106-2221-E-110-025-MY3].
dc.publisherInforma UK Limited
dc.relation.urlhttp://www.tandfonline.com/doi/full/10.1080/21663831.2018.1436092
dc.rightsThis is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/
dc.subjectThermoelectric (TE) material and module
dc.subjectinterfacial reaction
dc.subjectBi2Te3
dc.subjectPbTe
dc.titleInterfacial reactions in thermoelectric modules
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.identifier.journalMaterials Research Letters
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionDepartment of Materials and Optoelectronic Science, National Sun Yat-sen University, Kaohsiung, Taiwan
dc.contributor.institutionDepartment of Chemical and Materials Engineering, National Central University, Taoyuan, Taiwan
dc.contributor.institutionDepartment of Chemical Engineering, National Tsing Hua University, Hsinchu, Taiwan
kaust.personWei, Pei-chun
refterms.dateFOA2018-06-14T03:51:39Z
dc.date.published-online2018-02-20
dc.date.published-print2018-04-03


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This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Except where otherwise noted, this item's license is described as This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.