Interfacial reactions in thermoelectric modules

Abstract
Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well.

Citation
Wu H, Wu AT, Wei P, Chen S (2018) Interfacial reactions in thermoelectric modules. Materials Research Letters 6: 244–248. Available: http://dx.doi.org/10.1080/21663831.2018.1436092.

Acknowledgements
The authors acknowledge the financial support from the Ministry of Science and Technology, Taiwan [grant number 106-2221-E-110-025-MY3].

Publisher
Informa UK Limited

Journal
Materials Research Letters

DOI
10.1080/21663831.2018.1436092

Additional Links
http://www.tandfonline.com/doi/full/10.1080/21663831.2018.1436092

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