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dc.contributor.authorHussain, Muhammad Mustafa
dc.contributor.authorSevilla, Galo Torres
dc.contributor.authorCordero, Marlon Diaz
dc.contributor.authorKutbee, Arwa T.
dc.date.accessioned2018-01-28T12:16:40Z
dc.date.available2018-01-28T12:16:40Z
dc.date.issued2017-11-23
dc.date.submitted2016-05-16
dc.identifier.urihttp://hdl.handle.net/10754/626898
dc.description.abstractHigh performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.
dc.relation.urlhttp://www.google.com/patents/WO2017199148A1
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017199148A1&KC=A1&FT=D
dc.titleDecal electronics for printed high performance cmos electronic systems
dc.typePatent
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Division
dc.contributor.departmentMaterials Science and Engineering Program
dc.description.statusPublished Application
dc.contributor.assigneeKing Abdullah University Of Science And Technology
dc.description.countryWorld Intellectual Property Organization (WIPO)
dc.identifier.applicationnumberWO 2017199148 A1
refterms.dateFOA2018-06-14T02:55:20Z


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