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    Decal electronics for printed high performance cmos electronic systems

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    WO2017199148A1.pdf
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    704.9Kb
    Format:
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    Description:
    Published Application
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    Type
    Patent
    Patent Status
    Published Application
    Authors
    Hussain, Muhammad Mustafa cc
    Sevilla, Galo Torres
    Cordero, Marlon Diaz
    Kutbee, Arwa T. cc
    Assignee
    King Abdullah University Of Science And Technology
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Material Science and Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2017-11-23
    Submitted Date
    2016-05-16
    Permanent link to this record
    http://hdl.handle.net/10754/626898
    
    Metadata
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    Abstract
    High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.
    Application Number
    WO 2017199148 A1
    Additional Links
    http://www.google.com/patents/WO2017199148A1
    http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017199148A1&KC=A1&FT=D
    Collections
    Patents; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Material Science and Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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