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    A wearable 3D motion sensing system integrated with a Bluetooth smart phone application: A system level overview

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    Type
    Conference Paper
    Authors
    Karimi, Muhammad Akram cc
    Shamim, Atif cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
    Date
    2018-01-02
    Online Publication Date
    2018-01-02
    Print Publication Date
    2017-10
    Permanent link to this record
    http://hdl.handle.net/10754/626777
    
    Metadata
    Show full item record
    Abstract
    An era of ubiquitous motion sensing has just begun. All electronic gadgets ranging from game consoles to mobile phones have some sort of motion sensors in them. In contrast to rigid motion sensing systems, this paper presents a system level description of a wearable 3D motion sensor. The sensing mechanism is based upon well-established magnetic and inertial measurement unit (MIMU), which integrates accelerometer, gyroscope and magnetometer data. Two sensor boards have been integrated within a wearable arm sleeve to capture 3D orientation of the human arm. The sensors have been interfaced with a Bluetooth transceiver chip, which transmits data to a mobile phone app using standard Bluetooth protocol. An android mobile phone app has been developed to display the human arm motion in real time.
    Citation
    Karimi MA, Shamim A (2017) A wearable 3D motion sensing system integrated with a Bluetooth smart phone application: A system level overview. 2017 IEEE SENSORS. Available: http://dx.doi.org/10.1109/ICSENS.2017.8234404.
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    2017 IEEE SENSORS
    DOI
    10.1109/ICSENS.2017.8234404
    Additional Links
    http://ieeexplore.ieee.org/document/8234404/
    ae974a485f413a2113503eed53cd6c53
    10.1109/ICSENS.2017.8234404
    Scopus Count
    Collections
    Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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