3D printed System-on-Package (SoP) for environmental sensing and localization applications
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Online Publication Date2017-12-22
Print Publication Date2017-10
Permanent link to this recordhttp://hdl.handle.net/10754/626619
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AbstractThis paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.
CitationZhen S, Bilal RM, Shamim A (2017) 3D printed System-on-Package (SoP) for environmental sensing and localization applications. 2017 International Symposium on Antennas and Propagation (ISAP). Available: http://dx.doi.org/10.1109/ISANP.2017.8228793.