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dc.contributor.authorQaiser, Nadeem
dc.contributor.authorKhan, S. M.
dc.contributor.authorNour, Maha A.
dc.contributor.authorRehman, M. U.
dc.contributor.authorRojas, J. P.
dc.contributor.authorHussain, Muhammad Mustafa
dc.date.accessioned2017-12-05T06:12:00Z
dc.date.available2017-12-05T06:12:00Z
dc.date.issued2017-11-21
dc.identifier.citationQaiser N, Khan SM, Nour M, Rehman MU, Rojas JP, et al. (2017) Mechanical response of spiral interconnect arrays for highly stretchable electronics. Applied Physics Letters 111: 214102. Available: http://dx.doi.org/10.1063/1.5007111.
dc.identifier.issn0003-6951
dc.identifier.issn1077-3118
dc.identifier.doi10.1063/1.5007111
dc.identifier.urihttp://hdl.handle.net/10754/626281
dc.description.abstractA spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.
dc.description.sponsorshipThis publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. We declare no competing financial interest.
dc.publisherAIP Publishing
dc.relation.urlhttp://aip.scitation.org/doi/full/10.1063/1.5007111
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Applied Physics Letters and may be found at http://doi.org/10.1063/1.5007111.
dc.subjectElectronic circuits
dc.subject3D printing
dc.subjectGalactic properties
dc.subjectDeformation
dc.subjectNumerical
dc.titleMechanical response of spiral interconnect arrays for highly stretchable electronics
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Disruptive Electronic Applications (IDEA) Lab
dc.contributor.departmentIntegrated Nanotechnology Lab
dc.identifier.journalApplied Physics Letters
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionElectrical Engineering, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia
kaust.personQaiser, Nadeem
kaust.personKhan, S. M.
kaust.personNour, Maha A.
kaust.personHussain, Muhammad Mustafa
kaust.grant.numberOSR-2016-KKI-2880


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