Mechanical response of spiral interconnect arrays for highly stretchable electronics
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KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Disruptive Electronic Applications (IDEA) Lab
Integrated Nanotechnology Lab
KAUST Grant NumberOSR-2016-KKI-2880
Online Publication Date2017-11-21
Print Publication Date2017-11-20
Permanent link to this recordhttp://hdl.handle.net/10754/626281
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AbstractA spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.
CitationQaiser N, Khan SM, Nour M, Rehman MU, Rojas JP, et al. (2017) Mechanical response of spiral interconnect arrays for highly stretchable electronics. Applied Physics Letters 111: 214102. Available: http://dx.doi.org/10.1063/1.5007111.
SponsorsThis publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. KAUST-KFUPM Special Initiative OSR-2016-KKI-2880. We declare no competing financial interest.
JournalApplied Physics Letters