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dc.contributor.authorWyatt-Moon, Gwenhivir
dc.contributor.authorGeorgiadou, Dimitra G
dc.contributor.authorSemple, James
dc.contributor.authorAnthopoulos, Thomas D.
dc.date.accessioned2017-12-04T12:57:32Z
dc.date.available2017-12-04T12:57:32Z
dc.date.issued2017-11-27
dc.identifier.citationWyatt-Moon G, Georgiadou DG, Semple J, Anthopoulos TD (2017) Deep Ultraviolet Copper(I) Thiocyanate (CuSCN) Photodetectors Based on Coplanar Nanogap Electrodes Fabricated via Adhesion Lithography. ACS Applied Materials & Interfaces. Available: http://dx.doi.org/10.1021/acsami.7b12942.
dc.identifier.issn1944-8244
dc.identifier.issn1944-8252
dc.identifier.pmid29172422
dc.identifier.doi10.1021/acsami.7b12942
dc.identifier.urihttp://hdl.handle.net/10754/626275
dc.description.abstractAdhesion lithography (a-Lith) is a versatile fabrication technique used to produce asymmetric coplanar electrodes separated by a <15 nm nanogap. Here, we use a-Lith to fabricate deep ultraviolet (DUV) photodetectors by combining coplanar asymmetric nanogap electrode architectures (Au/Al) with solution-processable wide-band-gap (3.5–3.9 eV) p-type semiconductor copper(I) thiocyanate (CuSCN). Because of the device’s unique architecture, the detectors exhibit high responsivity (≈79 A W–1) and photosensitivity (≈720) when illuminated with a DUV-range (λpeak = 280 nm) light-emitting diode at 220 μW cm–2. Interestingly, the photosensitivity of the photodetectors remains fairly high (≈7) even at illuminating intensities down to 0.2 μW cm–2. The scalability of the a-Lith process combined with the unique properties of CuSCN paves the way to new forms of inexpensive, yet high-performance, photodetectors that can be manufactured on arbitrary substrate materials including plastic.
dc.description.sponsorshipG.W.M. and T.D.A. acknowledge the Engineering and Physical Sciences Research Council (EPSRC) grant no. EP/G037515/1. D.G.G. and T.D.A. acknowledge financial support from the European Union’s Horizon 2020 research and innovation programme (under the Marie Skłodowska-Curie grant agreement 706707).
dc.publisherAmerican Chemical Society (ACS)
dc.relation.urlhttp://pubs.acs.org/doi/10.1021/acsami.7b12942
dc.rightsThis document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials & Interfaces, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see http://pubs.acs.org/doi/10.1021/acsami.7b12942.
dc.subjectcoplanar electrodes
dc.subjectphotodiode
dc.subjectphotosensitivity
dc.subjectresponsivity
dc.subjectsolution-processed
dc.titleDeep Ultraviolet Copper(I) Thiocyanate (CuSCN) Photodetectors Based on Coplanar Nanogap Electrodes Fabricated via Adhesion Lithography
dc.typeArticle
dc.contributor.departmentKAUST Solar Center (KSC)
dc.contributor.departmentMaterial Science and Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journalACS Applied Materials & Interfaces
dc.eprint.versionPost-print
dc.contributor.institutionCentre for Plastic Electronics and Department of Physics, Blackett Laboratory, Imperial College London, London SW7 2BW, U.K.
kaust.personAnthopoulos, Thomas D.
dc.date.published-online2017-11-27
dc.date.published-print2017-12-06


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